Electronics Forum: theme (Page 2 of 4)

Surface Tension vs Part Mass

Electronics Forum | Wed Sep 13 10:49:07 EDT 2006 | slthomas

1/4-20 would be unlikely to fit on an 0603 is all. I have to admit that when he first brought up the hardware theme I kept visualizing a jack screw assembly but the results I envisioned were less than ideal.

Nordau?

Electronics Forum | Mon Jul 30 16:27:32 EDT 2007 | davef

We found it by looking here: http://www.conti-online.com/generator/www/us/en/continentalteves/continentalteves/themes/suppliers/downloads/1240288S01_AG_en.pdf

Smt parts in strips

Electronics Forum | Thu May 10 12:57:03 EDT 2012 | gnus

Seems like this is a common theme. It was always an uphill battle with management to get them to understand small strips costs us more time which in turn costs more money. Our management never got it so we had to think of ways around it.

Re: Solder Paste Printing Text

Electronics Forum | Wed Aug 23 16:57:10 EDT 2000 | Dr. Ning-Cheng Lee

Regarding solder paste printing, many books available on the market all have some sections addressing this topic. Unfortunately, as of today, solder paste printing has not been the main theme of any book yet. I consider the better sources of informat

Matted surface of solder joint

Electronics Forum | Tue Sep 10 07:24:13 EDT 2002 | John

I need teoretical info for theme "Matted surface vs solder ball". Is it right that some solder pastes decrease solder balling but give matted surface after reflow? That diference between these pastes and others? Are the matted surface worse solder b

PROBLEMS WHILE GLUE PRINTING

Electronics Forum | Thu Sep 20 16:51:31 EDT 2001 | jschake

Using an enclosed pressurized printhead system will significantly reduce the waste produced compared to printing glue using squeegees. In trying to stay with the 0201 theme here, I will add that printing glue or adhesive for 0201s continues to be a

Flex circuits

Electronics Forum | Sat Jul 03 11:20:08 EDT 2004 | KEN

....not unique. But tough as hell! I build flex assemblies for a major P&P equipment manufacturer. Some are pure flex, most are ridgid flex. And of course, why put fiducials on the boards to help the process (why God, why me?) We use pallets and

PCI & Compact PCI

Electronics Forum | Mon Feb 19 01:59:15 EST 2001 | dadi

I'm looking for a Transtarent & Non-Transparent PCI-to-PCI bridge that compliant with the Compact PCI Spec. This bridge must have the ability to be configured as Transparent or Non-Transparent. I aware to one chip that have those abilities. This chip

Where's The Drill?

Electronics Forum | Wed Nov 21 14:10:39 EST 2001 | raton

I agree. Machine operators can jimmy up a $150k piece of equipment and get by saying something like 'I didn't know that dropping a scewdriver in doze movin parts would break anyting!' with out more than a token slap on the wrist. However, you're on

No-Lead solder defect - No solder on pads

Electronics Forum | Mon Dec 22 19:43:43 EST 2003 | Dean

I have seen this affect on Immersion Tin and OSP. 70 to 90 % of the solder wicks to the lead and forms a "single" homogenous solder mass. This even though the pad was 100 % covered with paste... Evaluated different solder paste...did find variatio


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