Electronics Forum | Wed Feb 16 05:00:50 EST 2000 | Dean
What is the package type? TO92, TO5...etc. This temp. sensing device clips (mechanically) to the sink. And this requires a special tool? How about thermo bond heat sink compound? "output" by loc tite is the only flavor I can think of...There a
Electronics Forum | Wed Feb 16 05:00:50 EST 2000 | Dean
What is the package type? TO92, TO5...etc. This temp. sensing device clips (mechanically) to the sink. And this requires a special tool? How about thermo bond heat sink compound? "output" by loc tite is the only flavor I can think of...There a
Electronics Forum | Sat Apr 04 08:35:27 EDT 2009 | davef
Cause: Solder between the pad and the BGA on the pads being lifted has not melted. So, when you lift the BGA, you also lift those pads with the unmelted solder with the BGA. These pads are probably sinking the heat to a large copper plane in a inner
Electronics Forum | Mon Oct 26 15:59:38 EST 1998 | carlm
| What are the key feature to look for in buying a profiling product for Reflow ? | | Who's is the best and how much do these systems cost ? | | Thanks in advance. | | Hi Mark, I am currently the oven sector engineer for a large CM. I spend a lo
Electronics Forum | Wed Apr 09 20:05:21 EDT 2003 | davef
Kevin: We know of no handy approach to developing recipes. * Certainly programs provided by profiler suppliers give you a good first pass, based on your oven and solder paste. * Second pass in developing your recipe comes through trail and error chan
Electronics Forum | Thu Dec 14 19:32:05 EST 2000 | Dave F
Wow, someone read the fine SMTnet Archives!!!! Scary, get their name!!! [OK, I�ll stop ... Several points are: * Most of the stuff in the fine SMTnet Archives is all the bad things that we can make-up to respond to the questions people ask. Ther
Electronics Forum | Tue Jan 04 10:00:19 EST 2005 | Carmichael
No mystery there... The balls are reflowed by conduction of heat from the package itself and the backside preheater just as in any other rework machine. The laser is just another method of precisely heating the entire package. The advantage is overa
Electronics Forum | Wed Feb 15 08:47:09 EST 2006 | pjc
Yes, doing the DoEs on your wave to achieve optimum settings that deliver the best results on your worst board is correct method. If not clear on the process, there are still wave solder process classes out there you can attend or hire in-house. If y
Electronics Forum | Mon Apr 23 17:30:08 EDT 2001 | davef
Step 1: Print paste on the board, skip placement, reflow the board, check solderability. Step 2: Goto Step 1. White Tin Solderability: The most common reason for solderability issues with the white tin surface coating during multiple thermal excur
Electronics Forum | Mon Mar 08 19:41:31 EST 2004 | Ken
Robert, what you have provided is not a "profile". It is a "recipe" or "job". I have 4 BTU VIP98's. I have hundreds of recipes...Your temps look similar to mine....but what does that have to do with the "thermal profile" as experienced by the asse
