Electronics Forum: thermal pad (Page 2 of 49)

Power component thermal via

Electronics Forum | Tue Feb 01 04:11:58 EST 2000 | emmanuel

I am to assembly a power SO on the top side of a double side board. My designer has implemented a lot of thermal vias in the heat sink pad of this component. The problem is that i need to prevent the solder cream from polluting the bottom side of the

Re-soldering QFP with thermal pads

Electronics Forum | Thu Oct 31 01:52:17 EST 2002 | jason

Anybody with experience on such a rework ?? The QFP has thermal pads underneath the body and needs to be re-connected when subjected for rework... Any ideas ???

Re-soldering QFP with thermal pads

Electronics Forum | Thu Oct 31 09:34:38 EST 2002 | russ

We do this all of the time, This is what we do but I would be interested in other methods. 1. Remove component with BGA type rework station 2. Wick off lead pads only, verify/create even solder surface on the thermal pad on the board 3. Apply no-cle

Re: Power component thermal via

Electronics Forum | Wed Feb 02 03:32:08 EST 2000 | pascal MATHIEU

emmanuel : i agree with Dave , it's easy to have blind hole on the bottom side , of course in this case you'll lose some thermal efficiency ;the second solution is to put on the bottom side between the board and your heatsink a soft thermal interfac

Uneven thermal load in PCB design.

Electronics Forum | Mon Dec 16 10:31:21 EST 2002 | davef

Grant, On those 'dry pads', where does the solder paste end-up after soldering? On: * Pads * Component leads * Someplace else [Where?]

Uneven thermal load in PCB design.

Electronics Forum | Mon Dec 16 21:51:28 EST 2002 | grantp

Hi, It's on the pads. They look ok, but when you check the lead comes away from the solder. Regards, Grant Blackmagic Design

Number of thermal excursions per componet

Electronics Forum | Wed Jun 27 21:05:48 EDT 2001 | davef

BGA Cycle 1: solder ball attach. BGA Cycle 2: BGA attach to board. BGA Cycle 3: BGA removal from board. BGA Cycle 4: BGA pad dress. BGA Cycle 5: BGA ball replacement. BGA Cycle 6: BGA re-attach to board. Board Cycle 1: BGA attach to board. Boar

QFN Thermal pad voiding

Electronics Forum | Fri May 15 10:04:59 EDT 2009 | aj

Hi all, Is there any standard for percentage voiding on the center thermal pad on a QFN? We use the dot matrix array for paste to allow for outgassing etc, but we have had a couple of xray inspection "fails" for voiding on this pad , in or around 3

QFN Thermal pad voiding

Electronics Forum | Mon Jun 01 16:48:16 EDT 2009 | stevezeva

Mika, Have you ever worked with a 3-row I/O QFN? QFN180 to be exact? Steve

QFN Thermal pad voiding

Electronics Forum | Tue May 19 15:06:36 EDT 2009 | c111

we had many problems with this. there is no standard that I could ever find. we came up with our own after weeks of headaches. we use 25% as our guide line we use window pain only for the center paid to allow for out gassing and reduce 15-20% globaly


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