Electronics Forum | Fri Oct 01 10:04:20 EDT 1999 | Andrew William Dalrymple
I am currently in the middle of a company wide war and I'm looking for data (AMMO). Here are the problems: 1) I am looking for anyone who has done or seen any reports on Thermal Shock to smt parts and/or via holes caused by Soldering Irons at rewor
Electronics Forum | Fri Oct 01 16:17:10 EDT 1999 | Dave F
| I am currently in the middle of a company wide war and I'm looking for data (AMMO). Here are the problems: | | 1) I am looking for anyone who has done or seen any reports on Thermal Shock to smt parts and/or via holes caused by Soldering Irons at
Electronics Forum | Fri Jun 06 06:11:18 EDT 2014 | paulg
I have a large monoblock ceramic filter on a PTFE based pcb material. The filter has a metal casing soldered onto the ceramic filter. I am concerned that if the heating rate is to rapid, then thermal shock / differential expansion could cause the fil
Electronics Forum | Thu Oct 14 10:49:13 EDT 1999 | Dan Woodward
Andrew, As I read about issues with reworking connectors, whether they are surface mount or PTH soldered, I wonder if compliant pin pressfit connectors are being considered. They are easily assembled after all SMT without any thermal input, and on e
Electronics Forum | Mon Jun 09 11:11:57 EDT 2014 | cyber_wolf
What does the technical data sheet for the component recommend for reflow profile ? Can you post a photo of the component ?
Electronics Forum | Sat Oct 02 03:27:52 EDT 1999 | Brian
| I am currently in the middle of a company wide war and I'm looking for data (AMMO). Here are the problems: | | 1) I am looking for anyone who has done or seen any reports on Thermal Shock to smt parts and/or via holes caused by Soldering Irons at
Electronics Forum | Sat Oct 02 20:19:19 EDT 1999 | John Dwinell
| | I am currently in the middle of a company wide war and I'm looking for data (AMMO). Here are the problems: | | | | 1) I am looking for anyone who has done or seen any reports on Thermal Shock to smt parts and/or via holes caused by Soldering Ir
Electronics Forum | Tue Jul 30 07:29:06 EDT 2013 | scotceltic
We are currently experiencing thermal shock failure on a BGA package. We are currently looking at improvements to improve the thermal shock properties by using underfilm. I have seen some studies out there that use this process to improve drop test
Electronics Forum | Thu Jun 06 12:54:23 EDT 2013 | emeto
I think that you will be fine. You don't want to crack the part during it's stay on a high temperature in the reflow oven(thermal shock...thermal stress...). Once you mount the part on the board it will collect moisture again, but it is already proce
Electronics Forum | Wed Oct 15 09:53:01 EDT 2003 | markhoch
These boards also were above liquidus for 75 seconds, and the customer puts the boards thru extensive thermal shock and stress testing. An Alpha Applications engineer told me that because the boards were above 183 degrees for 65-75 seconds that the i
