Electronics Forum | Tue Mar 28 07:28:25 EST 2006 | Rob C
I would have to disagree on this. My experience is that you should never justify capital expediture based on just the obvious up front costs alone. There is no mention of risk of recall, warranty costs, scrap costs,and so on. Which you may get from a
Electronics Forum | Tue Feb 20 19:12:07 EST 2001 | billschreiber
Hello Kerry, If your stencils are going back into inventory rather than into production, expediting the drying process may not be necessary. Just place them on a rack and allow them to air dry naturally. That way you can maximize the throughput of
Electronics Forum | Mon May 16 22:59:40 EDT 2005 | davef
We believe your problem is caused by the mismatch in CTE of the material ised in your BGA. In fact, this "potato chipping" [where the corners curl-up] is present in all BGA. The issue is the matter of degree. [Mismatching CTE is how old thermostats
Electronics Forum | Sat Oct 02 03:27:52 EDT 1999 | Brian
| I am currently in the middle of a company wide war and I'm looking for data (AMMO). Here are the problems: | | 1) I am looking for anyone who has done or seen any reports on Thermal Shock to smt parts and/or via holes caused by Soldering Irons at
Electronics Forum | Sat Oct 02 20:19:19 EDT 1999 | John Dwinell
| | I am currently in the middle of a company wide war and I'm looking for data (AMMO). Here are the problems: | | | | 1) I am looking for anyone who has done or seen any reports on Thermal Shock to smt parts and/or via holes caused by Soldering Ir
