Electronics Forum | Wed Jul 17 15:00:37 EDT 2013 | jmiller
what is the effect of pre-dip tank temp. and dip tank temp. on the thickness of the IAg?
Electronics Forum | Wed Apr 23 17:28:46 EDT 2008 | davef
The need to prebake boards to remove moisture from the board [to prevent voiding] prior to wave soldering is driven by the thickness of through hole plating. * 1 thou [25um] or greater requires no prebaking * LT 1 thou [25um] requires prebaking
Electronics Forum | Tue Oct 27 22:52:18 EDT 2009 | davef
Top picture: We're not wild about the 'poor registration,' the differing thickness of the solder mask, and the crud all over the board. But, then again, we don't have a basis for rejection. Bottom picture: No basis for rejection Help us out, what do
Electronics Forum | Sun Nov 01 23:51:44 EST 2009 | boardhouse
Hi Julie, My opinion is that the top board would not pass IPC, solder mask encroachment on pads. Second board is what we call Orange peel,this can be caused two way's. 1) the solder mask was not tack dried enough prior to imaging which caused artwo
Electronics Forum | Mon Aug 27 11:51:47 EDT 2012 | cobham1
Its no my turn to give some advise. My first question would be can you put the boards into a carrier of some sort. There are many wonderful companies that make carriers that are ment for running down a smt line. This can be expensive unless you order
Electronics Forum | Mon Aug 27 12:31:04 EDT 2012 | rway
Its no my turn to give some advise. My first > question would be can you put the boards into a > carrier of some sort. There are many wonderful > companies that make carriers that are ment for > running down a smt line. This can be expensive > u
Electronics Forum | Sat Apr 30 11:34:23 EDT 2016 | huanyupcb
High Mix,Low Volume,Short Delivery PCB Supplier. 1.The world top 500 PCB supplier.( Samsung DELL Alcatel-Lucent Huawei Lenovo FOXCONN ASUS etc ) 2.Over 15+ Years of PCB Expertise. 3.Provided "PCB & Assembly One-stop shop"service,No MOQ. 4.ISO9001 I
Electronics Forum | Tue Apr 26 11:22:48 EDT 2005 | denismeloche
I have found that Sn62 solder gives better strength and leach resistance when soldering to gold surfaces. The gold needs to be at least 5 to 10 micro inches thick to prevent nickel oxidation but if over 25 micro inches will cause brittleness. I hav
Electronics Forum | Mon Oct 28 07:07:39 EST 2002 | cyber_wolf
It has been my experience that when all conditions are as they are supposed to be there should be zero or very little deflection. When you start placing components with pick and place equipment that does not have a Z pressure sense, you run the possi
Electronics Forum | Wed Oct 30 01:23:22 EST 2002 | jasper
It has been my experience that when all > conditions are as they are supposed to be there > should be zero or very little deflection. When > you start placing components with pick and place > equipment that does not have a Z pressure sense, > yo
Products, services, training & consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep, Distributor & Service Provider for Seamark/Zhuomao and Shuttle Star BGA Rework Stations.
Training Provider / Manufacturer's Representative / Equipment Dealer / Broker / Auctions / Consultant / Service Provider
1750 Mitchell Ave.
Oroville, CA USA
Phone: (888) 406-2830
.gif)
