Electronics Forum | Fri Jun 08 15:37:41 EDT 2007 | ck_the_flip
Jim: I have limited knowledge, but here's what I know: 1. Yes, it's a standard process. In today's SMTNet, it's rarely mentioned, and few people reply to postings. 2. Nope. It's a "specialty" piece of equipment for most CEM's. Depending on you
Electronics Forum | Tue Jan 07 17:58:11 EST 2003 | davef
The following book has several chapters on various [ie, flow, no-flow, etc] underfils that could help you: Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies; John H. Lau; McGraw-Hill Professional; ISBN: 0071351418; 1st edition; 200
Electronics Forum | Mon Jan 06 11:23:30 EST 2003 | emeto
Hi all, Can anyone give me more info about Flip Chip assembly without underfill.Some technics,necessary equipment(optics,linear motors,accuracy and so on)or where i can read about it.
Electronics Forum | Wed Jan 08 03:27:18 EST 2003 | MA/NY DDave
Hi Another add, This depends on your application environment. If you have levels of shock and vibration or high thermals underfill is needed. YiE, MA/NY DDave
Electronics Forum | Mon Apr 01 20:33:30 EST 2002 | davef
Regarding your underfil ... * What material did you use as an underfil? * What machine and technique did you use to apply the underfil? * What type of component were you underfilling? * What was the end-use environment?
Electronics Forum | Mon Apr 01 13:00:27 EST 2002 | BTaylor
We had a problem with conformal coating getting under an IC and with Temp. and vibration would cause cracking of the solder bump, underfill solved the problem.
Electronics Forum | Wed Mar 27 18:23:01 EST 2002 | kmorris
Does anyone have experience doing conformal coating over Plastic BGA in High-Rel PCB assembly? Is underfill necessary to avoid problems with entrapped air, etc? Our application is a 17x17mm BGA, 256 I/O. We are assembling with a water soluable pas
Electronics Forum | Tue Apr 02 11:21:46 EST 2002 | BTaylor
davef I assume this question is for my reply and me. We used a dexter\hysol underfill and a Camalot 5700 to dispense.Single line technique next to a small IC with 14 bumps around the perimeter.The conformal coating was applied with a small brush aro
Electronics Forum | Tue Apr 02 22:52:38 EST 2002 | davef
Tks BT Can't be many places tougher than automotive, 'cept maybe oil field, down pipe. We use Dexter Hysol flow underfills for both 1 thou and 3 thou gaps, but they wouldn't come close to filling under a BGA. Most BGA are sitting about 16+ thou fr
Electronics Forum | Wed Apr 03 10:50:06 EST 2002 | BTaylor
Any time Dave I can tell from your responses you have been around this block as many times as I have.Your right automotive is tough nowadays not only from the quality standpoint, now they want everything for free.
