Electronics Forum | Sat Nov 05 05:09:51 EST 2005 | ajay
we do keep out solder paste ready for next shift or for replenish. We specified a location to keep new paste ( only one container ) near stencil machine. As soon as that is use we put another container from freeze, we make sure that at specified loca
Electronics Forum | Wed Oct 26 23:29:57 EDT 2005 | milroyperera
Hi, As I have seen in the data sheets from solder paste suppliers they always recommend to keep the solder paste until it reaches the ambient temperature after taking out from normal storage temperature. Mostly the storage temperature is 5 - 10 Cels
Electronics Forum | Thu Oct 27 08:38:04 EDT 2005 | jdengler
Simply leave the paste out at the end of the shift for the next days use. Keeping the paste refrigerated just prolongs the shelf life. Even if you are at the expiration date leaving the paste out for 36 hrs won't make any difference. Jerry
Electronics Forum | Tue Aug 03 10:11:11 EDT 2010 | keiths487
we have an HSP that keeps giving nozzle level (low) out of tolerance, we have performed lighting check, also this condition is only showing up on 3 or 4 heads...any input appreciated
Electronics Forum | Mon Apr 26 14:40:07 EDT 2010 | blnorman
We had one product that used immersion silver plating. There were a couple of instances where we saw tarnishing, and elemental analysis confirmed the presence of sulfur. These boards did have the anti-tarnish sheets between boards, but somehow they
Electronics Forum | Wed Sep 04 22:48:13 EDT 2013 | winson16
SMT fine pitch connector having oxidation on lead and P&P machine keep rejecting the part. Is there any alternative way to reduce the part throw out rate without jeopardize the placement accuracy? Or is it possible to re-coat the connector lead or an
Electronics Forum | Fri Oct 11 09:49:07 EDT 2019 | ttheis
FYI I did try logicomm but the log files were empty. There must be something wrong with my connections from the force board to the EPC. I'll keep investigating. I also swapped the EPC to see if that makes any difference.
Electronics Forum | Fri Jul 04 00:36:25 EDT 2008 | shrek
Try a linear, very flat ramp rate on the order of 0.5 degrees celcius per second. I know this is hard to accomplish with a five zone, but try to lower the first couple of zones (the preheat zone), and then spike to reflow aggressively during your la
Electronics Forum | Fri Sep 06 14:03:18 EDT 2013 | horchak
If you are a CEM you are setting yourself up for failure and will be left holding the bag. Flash gold has one purpose. It is a protective coating for the base medal to keep it from oxidizing. It is very thin and will be absorbed into the solder joint
Electronics Forum | Fri Sep 20 01:39:21 EDT 2013 | winson16
gold, one of the stablest elements on the > periodic table oxidising. Are you sure, and why > would you want to reduce the vision fail rate on > a part that is clearly shockingly poor? Old inventory is holding a huge material cost and if i can f
