Electronics Forum | Mon Jun 29 13:50:48 EDT 1998 | Russ Miculich
| WHAT SHOULD THE RATIO BE OF STENCIL APERATURE TO PAD TO GET GOOD QUALITY RESULTS. BY THAT I MEAN, A MINIMM OF SOLDER BALLS, AND LITTLE TO NO BRIDGING, SHORTS, ETC.. | RIGHT NOW WE ARE USING A 1:1 RATIO, BUT ARE INVESTIGATING REDUCING THE APERATU
Electronics Forum | Tue Apr 30 07:49:38 EDT 2002 | johnw
shawn, define what you mean by solder ball's scattered across the board? I'd tend to agree with the thoughts of too much paste on chip's but normally your ball's would be mainly around these devices although som can move around depending on the surf
Electronics Forum | Thu Dec 08 14:26:58 EST 2005 | chunks
Start with your board first. Do you have resist/mask between the fine pitch? Is the finish HASL or a flat surface? If there is no mask/resist between the fine pitch leads you may want to reduce the apertures 5%. If the board is HASL, that means yo
Electronics Forum | Tue Nov 25 05:20:20 EST 2014 | grimus
Could be. I am making overprint to achieve proper amount of solder paste inside hole. Now I am trying to reduce maximum overprint and compensate it with step - up stencil. This could reduce effect that some particles of solder paste are not gathering
Electronics Forum | Sun Mar 07 21:26:54 EST 1999 | Chris G.
| My printer evaluation has come down to the Fuji GP-6 or the Dek 265LT. I'm looking for experienced opinions on both of these options, we're currently running an older vintage Dek 265 printer that gives us constant electronic system problems. The v
Electronics Forum | Wed Mar 10 10:11:10 EST 1999 | Justin Medernach
| | My printer evaluation has come down to the Fuji GP-6 or the Dek 265LT. I'm looking for experienced opinions on both of these options, we're currently running an older vintage Dek 265 printer that gives us constant electronic system problems. The
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