Electronics Forum | Tue Feb 29 10:14:02 EST 2000 | Robert Hartmann
My company is just getting into the flip chip packaging arena. We are putting in a prototype/small volume wire bond PBGA line. We have some questions with regard to choosing solder balls and cleaning of flux. 1) Is there a formula for the shrink
Electronics Forum | Tue Nov 09 11:42:37 EST 1999 | Dave F
Jeff: Try this: ROSA. John�s spot on. I�ll add that it is a fluxless method that reduces the oxides in an aqueous solution. Another source of information is: Trench, M., Hillman, D., Lucey, G., "Environmentally Friendly Closed Loop Soldering,"
Electronics Forum | Tue Jul 30 08:38:55 EDT 2002 | dasal
Truthfully, there are pro's and con's for both technologies. (put cost of ownership aside for one moment) Nitrogen won't dry humidified components as rapidly as a desiccant dry box. I'm talking about a self regenerating dry box that uses molecular s
Electronics Forum | Wed Jan 03 21:20:22 EST 2007 | davef
Comments are: * General purpose RTV (RTV-108) releases an acetic acid (vinegar) during cure and corrodes copper, brass and sensitive metals. It is therefore NOT for use in delicate electrical or electronic applications. However, there is an electrica
Electronics Forum | Wed Sep 18 14:12:40 EDT 2013 | pjchonis
Hello Bachman. SAC305 is the most common lead-free solder alloy, not only for wave soldering but also selective. Most of our selective customers (especially automotive) are using SAC305. What is more important than the alloy to consider is the flux
Electronics Forum | Mon Oct 15 10:51:49 EDT 2001 | davef
On over printing, the general issues are: * Paste deposits being so large that when reflowing, collapse onto many, rather than a single solder mass. * Paste expanding during heating and being close to other solder deposits and bridging [as you say].
Electronics Forum | Sat Jun 06 09:53:59 EDT 1998 | Earl Moon
GEOMETRIC DIMENSIONING AND TOLERANCING (GDT) Using and applying GDT to printed circuitry and assemblies is very much like applying it to any other design for manufacturing (DFM) or design for assembly (DFA) requirement using concurrent engineering (C
Electronics Forum | Mon Jul 12 11:35:27 EDT 2004 | Pierre RICHARD
Here are some answers to my questions after a good research. I also added more definitions that could help understand this esoteric language used in assembly, specially surrounding fluxes and their use. In blue italics are comments and extracts from
Electronics Forum | Mon Apr 09 21:09:29 EDT 2012 | isd_jwendell
I haven't worked with anything as small as 01005s, but something you didn't mention is the %metal of your paste. I just switch from 90% to 89.5% (AIM NC257-2) and could tell the difference. Just an idea...
Electronics Forum | Mon Dec 17 19:01:45 EST 2007 | bbarton
As someone with a LOT of experience with the "low cost" alternative alloys, primarily SACX, I have one simple question....Are these shorts a new phenomena? WAS your process in control, and all of a sudden it's not? If the answer is YES, take a look a
