Electronics Forum | Sat Oct 12 06:43:49 EDT 2002 | davef
Alternatives to consider are: * Opening-up your stencil aperture put-down more paste to compensate for the amount that is being used to fill the via. * Relaying-out the board to plug and plate over the via. * Relaying-out the board to move the via fr
Electronics Forum | Fri Nov 03 02:32:56 EST 2006 | shivam
HI ALL, can anybody clear me what is via tenting and via pluging?? second one, if i use via in pad for an.5mm bga what care i should taken, what should be the soldermask open in top and innerlayers for via?how it will directly connect to top layer
Electronics Forum | Fri Nov 03 07:28:27 EST 2006 | davef
Via filling methods are: * Tenting * Plugging * Capping * Flooding Tented Via. A via covered with dry film soldermask; the via is not filled. When tenting from both sides there may be issues with trapped air that expands during mass soldering. Plug
Electronics Forum | Mon Feb 26 12:26:43 EST 2001 | CAM
I'm working a problem and looking for your input. Here the deal: Two sided mix technology board. Test is using unmasked via points on bottom for test points. Our fab drawing states tent via points on top side. First set of board came in with no tenti
Electronics Forum | Tue Sep 17 08:26:28 EDT 2002 | davef
Try: "Increasing Density By Placing Vias In Lands"; Blankenhorn, JC; 'Printed Circuit Design'; 11/98
Electronics Forum | Thu Jan 12 14:17:07 EST 2012 | blnorman
How are the vias failing? Barrel crack?
Electronics Forum | Tue Jan 17 12:06:12 EST 2012 | cobham1
The via's are cracking which then is causing all kinds of problems.
Electronics Forum | Sat Mar 27 08:15:02 EST 2004 | davef
Via in pad is a designer's dream and an assembler's nightmare. Search the fine SMTnet Archives for previous discussions to get started. VIP, via-in-pad, or whatever tend to promote voiding within the via and certainly partially starved solder conne
Electronics Forum | Thu Mar 15 13:27:45 EDT 2007 | Pete
We had a customer do a similar thing. We notified our customer and educated them on what was happening. We were instructed to try one and report on the results, as the vias were supposed to be filled (and weren't). We pasted and reflowed and as su
Electronics Forum | Sat Oct 12 05:40:05 EDT 2002 | Kenture
Hello All, I am having issued with insufficient solder due to via in pad. It is a 10 mils via and PCB is 70 mil thick. Six mils stencils was used since there are some 20 mils (No clean process). Any recommendation? Thank you.