Electronics Forum | Wed Oct 03 09:23:21 EDT 2012 | kkay
Well what we have seen so far is that the voiding occurs on nearly every part, but only underneath the terminations. When we run a board with no parts we do not see any voiding as there are no terminations to trap the out-gassing from the pads. Next
Electronics Forum | Tue Sep 25 11:50:37 EDT 2012 | davef
Ken ... I resized your picture so that it fits on the page better. Continuing with your outgassing through the solder pads theory, how thick is the copper on the pads? I don't expect to see outgassing through pad that are a thou or more in thickness
Electronics Forum | Tue Jan 14 12:20:33 EST 2020 | cyber_wolf
If you are using standard alloy and flux types and you are within the ballpark of 30-90 seconds above liquidous you should be fine. As I said above unless your profile is grossly off, it is not the cause of your voids.
Electronics Forum | Tue Oct 02 16:07:37 EDT 2012 | mmjm_1099
Have you come to a conculsion on this yet? If so please post for all to review.
Electronics Forum | Tue Oct 23 08:07:44 EDT 2012 | kkay
I have attached a PDF overview of some test we have done and the results. (fixed oven profile)
Electronics Forum | Thu Oct 25 11:25:56 EDT 2012 | aj
great report and good to see results
Electronics Forum | Thu Nov 01 10:52:06 EDT 2012 | kris1128
Hello kkay, can I ask what type of solder paste the #4 sample was? Thanks!
Electronics Forum | Tue Jan 07 17:33:26 EST 2020 | SMTA-Norah
Were the boards baked out before soldering? Is there plated over vias in the pads?
Electronics Forum | Wed Jan 08 10:04:29 EST 2020 | emeto
We don't have plated vias on these pads.
