Electronics Forum: wave and component and mov (Page 2 of 8)

Clearance between Through hole and chip component

Electronics Forum | Wed Feb 28 00:01:47 EST 2007 | Muhammad Haris

Hi, The distance between the two terminations/endings/pads of 0603 (0201)is 0.15mm i.e. lesser than than the distance between the 0603 and through hole i.e. 0.5mm My ques is that, then why its termination doesnot short as it has a minimum distance.A

Epoxy printing and wave soldering on 0603 and 0402 components

Electronics Forum | Mon Jul 12 21:05:06 EDT 1999 | karlin

Hi, I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants) Secondly, I need also facing a lo

Re: Standard pad sizes for reflow and wave

Electronics Forum | Fri Sep 03 14:37:45 EDT 1999 | JohnW

| | We've noticed that there are many different recommendations for pad sizes for various SMT parts. This seems to vary wildly from manufacturer to manufacturer for the same case sizes. Is there any standards that can used used to specify these siz

Re: Standard pad sizes for reflow and wave

Electronics Forum | Mon Sep 06 19:59:59 EDT 1999 | armin

| | | We've noticed that there are many different recommendations for pad sizes for various SMT parts. This seems to vary wildly from manufacturer to manufacturer for the same case sizes. Is there any standards that can used used to specify these s

Re: Standard pad sizes for reflow and wave

Electronics Forum | Sun Sep 05 03:52:11 EDT 1999 | Brian

| We've noticed that there are many different recommendations for pad sizes for various SMT parts. This seems to vary wildly from manufacturer to manufacturer for the same case sizes. Is there any standards that can used used to specify these sizes

Re: Standard pad sizes for reflow and wave

Electronics Forum | Fri Sep 03 03:56:41 EDT 1999 | Wolfgang Busko

| We've noticed that there are many different recommendations for pad sizes for various SMT parts. This seems to vary wildly from manufacturer to manufacturer for the same case sizes. Is there any standards that can used used to specify these sizes

Re: wave soldering surface mount tantalum and ceramic capacitors

Electronics Forum | Tue Feb 16 16:28:30 EST 1999 | Tuffty

| | Can anyone help me with the pros and cons of trying to wave | | solder tantalum and large (1812) ceramic capacitors. I do | | know that one may see fractures on larger cermaic caps, but have not seen much on the tantalums. Any insight as to what

Re: Standard pad sizes for reflow and wave

Electronics Forum | Tue Sep 07 09:11:33 EDT 1999 | Dave F

| We've noticed that there are many different recommendations for pad sizes for various SMT parts. This seems to vary wildly from manufacturer to manufacturer for the same case sizes. Is there any standards that can used used to specify these sizes

Re: Epoxy printing and wave soldering on 0603 and 0402 components

Electronics Forum | Thu Jul 15 16:15:13 EDT 1999 | Doug

| Hi, | | I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants) | | Secondly, I need also f

Re: Epoxy printing and wave soldering on 0603 and 0402 components

Electronics Forum | Mon Jul 12 21:40:56 EDT 1999 | Earl Moon

| Hi, | | I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants) | | Secondly, I need also f


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