Surface Mount Technology Association (SMTA) | https://www.smta.org/southeast-asia/
. Many of us would agree that we are still facing challenges on one of the common defects – poor barrel fill. The problem is confounded with currently High density/Multilayer thick PCB and applying Lead-free soldering
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/de-DE/divisions/dage/about/blog/the-power-of-2d-and-3d-inspection
. In the electronics world we have similar x-ray techniques for non-destructive failure analysis. A quick 2D x-ray inspection provides a good insight into signs of defective connections, and a 3D CT scan can verify the problem with the added benefits of more data, building the complete picture ready for diagnosis. BGA (Ball Grid Array
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/about/blog/the-power-of-2d-and-3d-inspection
. In the electronics world we have similar x-ray techniques for non-destructive failure analysis. A quick 2D x-ray inspection provides a good insight into signs of defective connections, and a 3D CT scan can verify the problem with the added benefits of more data, building the complete picture ready for diagnosis. BGA (Ball Grid Array
| http://etasmt.com/cc?ID=te_news_industry,24567&url=_print
. (2) Improve welding wetting power and speed up wetting. (3) Reduce the generation of solder balls, avoid bridging, and get good welding quality. 2
| http://etasmt.com/te_news_industry/2021-09-01/24567.chtml
. (2) Improve welding wetting power and speed up wetting. (3) Reduce the generation of solder balls, avoid bridging, and get good welding quality. 2
| http://etasmt.com:9060/te_news_industry/2021-09-01/24567.chtml
. (2) Improve welding wetting power and speed up wetting. (3) Reduce the generation of solder balls, avoid bridging, and get good welding quality. 2
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_jedec-standard-footprints_topic2063.xml
. They do mention in Note 3 that there should be "Visible Wetting" but that's not possible with chips that do not have a terminal lead wraparound
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Vacuum-Fluxless-Reflow-Technology-for-Fine-Pitch.pdf
: contact angle of Sn wetting on Cu; H: solder bump height; D: bump diameter dimension, as well as flux agent wetting force. In this study, our focus is mainly on oxide removal agent wetting
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-selection-guide
. Alloys are called eutectic when the solidus and liquidus are equal. While wetting begins at the solidus temperature, best wetting is achieved at a peak temperature 15º
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/jedec-standard-footprints_topic2063_post8485.html
surface could cause placement problem on crowded PCB. Of course you can use the resistor pattern for both of them but then why cap have component end covered on all side and not the resistor