Electronics Forum | Wed Jun 23 11:47:48 EDT 1999 | Dave F
| In a month or so, we will be getting an in-line x-ray inspection machine. It will require that we solder our most comlicated side (normally top) first. This is opposite to our process now where we solder our passive (bottom) side first. We cann
Electronics Forum | Wed Jun 23 14:23:14 EDT 1999 | Cunli Jia
Dave, Looks like you just replied to Ryan's original question, but the message itself shows that the two of you have been going back and forth. Did you copy from your email discussion? Just curious whether something is going wrong with the Forum.
Electronics Forum | Wed Feb 26 21:38:08 EST 2003 | jonfox
1. First and foremost is paste alignment. If you start out of the gates with a bad paste/pad relationship, it will be nothing but problems down the line. AOI is not required, but dial in the alignment, QC if necessary, then introduce the boards to
Electronics Forum | Tue Oct 12 11:06:11 EDT 2004 | stefwitt
At least the few people left in this industry should make a stink, why all these jobs went to China and take efforts to get them back. If I take a typical line, which can do 20,000 components an hour, costs $ 200,000, a board with 50 different compon
Electronics Forum | Tue Jul 27 17:54:37 EDT 1999 | Earl Moon
| | | | | Presently protos of micro-bgas (80i/o) pitch .030/.031 | | | | | 12BGA per assembly | | | | | | | | | | The board is a (.062, 4 layers) FR-4 using Dry film | | | | | Pads .014inch | | | | | Vias within footprint .020inch | | | | | Vias to
Electronics Forum | Thu Jul 29 11:34:27 EDT 1999 | Justin Medernach
| | | | | | Presently protos of micro-bgas (80i/o) pitch .030/.031 | | | | | | 12BGA per assembly | | | | | | | | | | | | The board is a (.062, 4 layers) FR-4 using Dry film | | | | | | Pads .014inch | | | | | | Vias within footprint .020inch | | |
Electronics Forum | Thu Jul 29 15:29:30 EDT 1999 | Earl Moon
| | | | | | | Presently protos of micro-bgas (80i/o) pitch .030/.031 | | | | | | | 12BGA per assembly | | | | | | | | | | | | | | The board is a (.062, 4 layers) FR-4 using Dry film | | | | | | | Pads .014inch | | | | | | | Vias within footprint .02
Electronics Forum | Wed Jun 03 11:17:17 EDT 1998 | Brian Stumm
If your board is single sided you should convey it on a mesh belt conveyor. Unfortunately most assemblies these days are double sided which makes it difficult to convey on the mesh belt. Plus with the increasing population on SM boards the weight is
Electronics Forum | Wed Jun 03 14:37:53 EDT 1998 | Anthony
I really appreciate everybody taking the time to help me out with this problem. I'm going to run your input by the design engineer, after that I may be taking you up on that offer to contact you Earl. Again; thank you! Anthony | If your board is si
Electronics Forum | Wed Apr 08 00:49:37 EDT 1998 | Steve Gregory
Well...I think we just about beat this one to death, but I'll go ahead and add a couple more points to "pro-score" camp...WITH the caveat that it HAS to be done right! Yes, I will say that I've had to deal with the wrong spec'd or crappy scor
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