Electronics Forum: zephyrtronics (Page 2 of 3)

Serious stuff

Electronics Forum | Wed Aug 18 14:33:40 EDT 1999 | Earl Moon

OK folks, let's get real serious. Well, I shot off my big mouth yesterday during a scheduling meeting concerning DFM and rework. Again, what an irony, oxymoron, or that other thing. Anyway, I said it would take another 4 weeks to develop a process

Re: Serious stuff

Electronics Forum | Wed Aug 18 15:09:48 EDT 1999 | John Thorup

| OK folks, let's get real serious. | | Well, I shot off my big mouth yesterday during a scheduling meeting concerning DFM and rework. Again, what an irony, oxymoron, or that other thing. | | Anyway, I said it would take another 4 weeks to develop

Re: Serious stuff

Electronics Forum | Wed Aug 18 21:20:45 EDT 1999 | Dave F

| OK folks, let's get real serious. | | Well, I shot off my big mouth yesterday during a scheduling meeting concerning DFM and rework. Again, what an irony, oxymoron, or that other thing. | | Anyway, I said it would take another 4 weeks to develop

Re: Serious stuff

Electronics Forum | Thu Aug 19 04:42:50 EDT 1999 | Earl Moon

| | OK folks, let's get real serious. | | | | Well, I shot off my big mouth yesterday during a scheduling meeting concerning DFM and rework. Again, what an irony, oxymoron, or that other thing. | | | | Anyway, I said it would take another 4 weeks t

Re: Serious stuff

Electronics Forum | Thu Aug 19 12:14:22 EDT 1999 | Doug Nebel

| OK folks, let's get real serious. | | Well, I shot off my big mouth yesterday during a scheduling meeting concerning DFM and rework. Again, what an irony, oxymoron, or that other thing. | | Anyway, I said it would take another 4 weeks to develop

Low Melt Solder Chemistry for use in Rework Process

Electronics Forum | Wed Feb 07 13:44:09 EST 2007 | dsoohoo

After some precursory experimentation, I am planing on employing a form of low melting temp solder for use in reworking some very dense, copper core PCB's, both SMT and THT, which were originally mounted with 63/37 solder. The main problem with the

Re: Serious stuff

Electronics Forum | Wed Aug 18 16:09:51 EDT 1999 | Earl Moon

| | OK folks, let's get real serious. | | | | Well, I shot off my big mouth yesterday during a scheduling meeting concerning DFM and rework. Again, what an irony, oxymoron, or that other thing. | | | | Anyway, I said it would take another 4 weeks t

Re: Serious stuff

Electronics Forum | Wed Aug 18 16:38:41 EDT 1999 | ScottM

| | | OK folks, let's get real serious. | | | | | | Well, I shot off my big mouth yesterday during a scheduling meeting concerning DFM and rework. Again, what an irony, oxymoron, or that other thing. | | | | | | Anyway, I said it would take another

Re: Serious stuff

Electronics Forum | Thu Aug 19 13:43:59 EDT 1999 | Earl Moon

| | OK folks, let's get real serious. | | | | Well, I shot off my big mouth yesterday during a scheduling meeting concerning DFM and rework. Again, what an irony, oxymoron, or that other thing. | | | | Anyway, I said it would take another 4 weeks t

Re: BGA Pad Dressing After Removal Method

Electronics Forum | Thu Jun 04 12:05:43 EDT 1998 | Anthony

Dear Dave, I have a "possible" solution to your problem, though I have never tried it myself. If you're trying to come up with a non-abrasive technique for removing solder-keep reading. If it's a faster method you desire, do yourself a favor and hi


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