Electronics Forum | Wed Mar 16 21:07:50 EDT 2011 | jacki
Hi pls let me know if someone is using dispensing machine to apply solder paste for PTH components. I am facing the test , applying the sufficient amount of sodler paste into 0.4mm pitch holes. in the other hands, pls advise me if you are working for
Electronics Forum | Tue Jun 11 14:16:03 EDT 2013 | bandjwet
We are involved in a project for microBGA SAC rework. The pitch is 0.4mm and the devices are underfilled (softening 150C). The underfill comes off fairly easily but the pressure underneath the package as the underfill softens pushes up on the undersi
Electronics Forum | Tue Jun 11 14:21:35 EDT 2013 | bandjwet
We are involved in a project for microBGA SAC rework. The pitch is 0.4mm and the devices are underfilled (softening 150C). The underfill comes off fairly easily but the pressure underneath the package as the underfill softens pushes up on the undersi
Electronics Forum | Fri Jun 13 11:28:40 EDT 2014 | jimmyboz
There is a small cylindrical sensor on the air cylinder that that actuates the chuck. I can't remember if there are one or two. Its (they) are about 4mm x 20mm and I think (it) they have a signal light. Make sure it is mechanically working properl
Electronics Forum | Mon May 16 19:57:51 EDT 2016 | rx8pilot
I recently purchased some used ThinPRO precision feeders for my Quad IV-C (PPM 4000C). They are in great shape, but I do not know how to program them to index at 2mm Does anyone have experience with these that know how to program them? I can only go
Electronics Forum | Wed Aug 29 03:16:20 EDT 2018 | cannizzaro
It is recommended that the thickness of the stencil of 0.1mm, the steel mesh should be partially nano-coated. It is best not to dry easily, and the particles are not easy to be too large. I have tried ALLPCB for this kind of BGA in the past and they
Electronics Forum | Wed Sep 12 03:52:45 EDT 2018 | shascoet29
Hi, Is the IPC-A-610 applicable to CSP assemblies? Especially regarding the solder ball to solder ball distance versus the minimum electrical clearance for assembly(0.13mm/IPC-A-610). With a 0.4mm pitch component and 260 microns diameters balls, thi
Electronics Forum | Thu Aug 08 22:41:30 EDT 2019 | orbitcoms
The pick n place height for component was set to 1.4mm but I had not allowed for pin thickness. I added this (total height now 1.6mm) and I get very few solder bridges now. I might try 1.7 and see if it makes any further differnce
Electronics Forum | Wed Dec 23 13:29:09 EST 2020 | spoiltforchoice
Yeah, if the convenient non sticky tab for unpeeling is not important to you, narrow tape is another option. "Grid Tape" used for drawing lines on whiteboards is not too sticky and only 4mm wide. Most of the time the lazy option of pulling it really
Electronics Forum | Tue Jul 18 16:14:45 EDT 2023 | daniel_stanphill
I remember having seen an ad on LinkedIn or somewhere that showed a handheld pen capable of manual deposits even on 0402 and 0.4mm fine pitch pads. I have been trying to search for it today and am seeing some comparable products but nothing that look