Electronics Forum | Wed Mar 03 20:20:30 EST 1999 | Earl Moon
| We have recently had problems with bare boards coming in too thick. I would like to know how to properly specify the minimum and maximum thickness using the 13949F and IPC 4101 specs. (We currently use "MATERIAL: GFN 0620 C1/C1 A2A per MIL - P - 13
Electronics Forum | Thu Jul 09 21:04:50 EDT 1998 | Dave F
| Hi there, | I am looking for some informations concerning the shear or pull strength of a typical TQFP 20 mils leads in relationship with the Copper/Tin intermetalic layer thickness. Could anyone help? | | Thank in advandce. | rgs, | chiakl Chiakl
Electronics Forum | Thu Jun 08 16:12:19 EDT 2017 | davef
Your plater's recommendation should work fine. Your simple copper plate will work, but you'll be stepping into fighting a copper tarnish battle. Silver over the copper is a better choice. I was thinking a silver thickness of a minimum of 3 microns
Electronics Forum | Mon Apr 13 09:27:28 EDT 2009 | hxr6038
We had an issue with the finish, PCB manufacturer is telling that they had a problem with the Nickel rework, which resulted in 20% fall out. Please help me by providing the ENIG thickness for Flex boards, is it same as rigid boards as per IPC 4552. I
Electronics Forum | Tue Sep 25 11:50:37 EDT 2012 | davef
Ken ... I resized your picture so that it fits on the page better. Continuing with your outgassing through the solder pads theory, how thick is the copper on the pads? I don't expect to see outgassing through pad that are a thou or more in thickness
Electronics Forum | Wed Dec 20 16:30:40 EST 2006 | CK the Flip
I've seen smaller components have a "charred" appearance and a lack of wetting up the component termination. Also, extended heat exposure may introduce excessive IMC (intermetallic) formation - the bad kind, that is. That's where your IMC layer wil
Electronics Forum | Fri Nov 17 14:36:17 EST 2006 | Fer
Good afternoon all, There is an issue in my company regarding flatness on SMDs. The part I am fabricating is a multilayer assembly of .175" by .175" by .049" thick. The part is made out of a multilayer copper clad PTFE with a tin finish surface. Af
Electronics Forum | Thu Jun 10 12:10:41 EDT 1999 | Earl Moon
| | | I am starting a new project which involve 3 oz copper layer with 20 mil components on the top of the board and 0.040" thick copper with D2Pak on the bottom of the board. | | | There is anybody has experience on metal-based PCB reflow process?
Electronics Forum | Thu Jan 04 08:33:08 EST 2007 | davef
You cannot determine foil thickness from its weight per area, because of the significant variation in the density of electrodeposited [ED] copper. But people don't care. They do it regardless. (oz/ft2)||(mils)||(mm) 1/2||0.7||17.8 1||1.4||35.6 2||2
Electronics Forum | Tue Nov 27 20:32:38 EST 2001 | davef
Stress is meaningful if it affects the long term reliability in a product's end-use environment. I don�t believe that things are that straight forward, although it would be nice if they were. Consider that differences in materials, number of layers
