Electronics Forum | Wed Nov 02 21:58:17 EST 2005 | KEN
Copper wire will become thinner when dipped in tin/lead or lead free solder. The copper is disolved off of the bulk wire. This is one reason rework on solder pots must be restricted. Eventually, after repeated cycles you will have smaller and sma
Electronics Forum | Mon Nov 14 08:57:14 EST 2005 | James
Hello, I am looking at a manual solder bath that the operator will dip the boards into. We looked at the cost of a wave machine but it is not in the budget for this year so we would like to go with the static bath method. I was hoping someone would b
Electronics Forum | Wed Jan 11 08:27:35 EST 2006 | davef
MSK As GS told you in an earlier posting, J-STD-002 and IEC 68-2-69 describe methods and equipment for component solderability testing. Go get a copy of either one. The primary component solderability test methods are: * Dip and look method * Wett
Electronics Forum | Wed Oct 04 10:18:51 EDT 2006 | greg york
Now seen the Blow Holes and shallow inverted and non wetting problem an aweful lot over here. Over came the Blow Holes and shallow inverted joints by washing the bare PCB with hot Saponifier then rinse and dry = problem dissapears. Think most PCB ven
Electronics Forum | Fri Apr 06 08:45:48 EDT 2007 | davef
UNDERFILL The design of the component and the end-use environment drive the requirement fot underfill. Here is a good introduction: http://www.asymtek.com/news/articles/2002_globaltronics_csp_and_fcuf.pdf Google for more. We have no relationship, n
Electronics Forum | Mon Aug 11 09:59:40 EDT 2008 | John S.
Guys, We're seeing what looks like an issue where through hole solder joints from our ive solder process are cracking during the cooling phase of the soldering process. This was detected during thermal shock testing, and we have tracked it back to a
Electronics Forum | Wed Jan 26 10:43:32 EST 2011 | grahamcooper22
From our experience with our gel fluxes the depth of the flux cavity can be 30% ~ 70% of the ball diameter. You'll probably need to do some tests to find the optimum for your process. If you have really fast movement on pick and placement machine the
Electronics Forum | Mon Dec 16 13:03:00 EST 2019 | SMTA-Norah
Passives are at least fairly simple, generally either they solder or they don't, testing with paste stenciled on to glass slides is one variation and a hot solder dip is another. The glass slide is nice because it's closer to the end use scenario.
Electronics Forum | Fri Jan 24 06:45:19 EST 2020 | alpha1
Depending on your equipment. If you are running stand alone equipment. Separate Sequencer and Axial Inserter there's not much you can due expect check the process. The axial should still catch at least most of the defects. If you have a combination u
Electronics Forum | Wed Jun 07 20:59:08 EDT 2000 | Dave F
John: I agree give me something that is maintainable and repeatable, rather than this thing. Chrys wrote about the Optimizer in the archives. I think she like the Malcom Dip Tester and a piece of glass better than either one.
