Electronics Forum | Wed May 16 13:06:33 EDT 2007 | stepheniii
3.3.2.1 Moisture Barrier Bag (MBB) The moisture barrier bag shall meet MIL-PRF-81705, TYPE I requirements for flexibility, ESD protection, mechanical strength, and puncture resistance. The bags shall be heat sealable. The Water Vapor Transmission Rat
Electronics Forum | Tue Jun 20 14:19:04 EDT 2000 | Chrys Shea
Hi Mike, The Hadco design guidelines are really good - I was just there. To expand on what Dave said, scoring is an option, but I've never had good luck with it, myself. The scores are either too shallow, and I can't break the boards easily enough
Electronics Forum | Mon Jan 30 05:58:39 EST 2017 | rob
Hi all, > > Am new to SMT here. > > I have a very > thin laminate substrate which around 120um > thickess. Being that thin, warpage is constantly > an issue for us. > > For the solder printing part, > we have a number of problems. > > Being s
Electronics Forum | Fri Dec 18 22:20:41 EST 1998 | phillip hunter
| I have developing a BGA Process and having problems with | 310 IO PBGA reflowing. I am achieving good wetting exept | 2 to 5 balls on the outer perimeter I have a good profile | my air flow is set per mfg spec, the stange thing is that | it doe
Electronics Forum | Sun Dec 20 20:40:22 EST 1998 | Miguel Mariscal
I would love to send a copy of my profile thanks, our machine is also a Summit 2000. | | I have developing a BGA Process and having problems with | | 310 IO PBGA reflowing. I am achieving good wetting exept | | 2 to 5 balls on the outer perimeter
Electronics Forum | Sat Jun 20 19:49:39 EDT 2020 | kylehunter
Hi all. We recently expanded our assembly space and moved our Heller 1500 oven to a new spot. In the old arrangement, we used a Purex filtration unit, keeping the hot air in our space. Recirculating the fumes caused a massive headache in cooling the
Electronics Forum | Sun Apr 25 04:34:09 EDT 1999 | Earl Moon
No this message isn't about my triumphant return. It's not even about that lady I wanted to run away with to Mehico (who were you again). It's about progress and some of you might be interested, or not. 1) For DEKheads, I submit we had two of Britai
Electronics Forum | Mon Mar 25 21:50:10 EST 2002 | davef
Some of this was copped from Fred. There are numerous package types that now fall under the rubric of land grid array [LGA]. Land grid devices [ie, Bumped Chip Carrier� [BCC], LGA, Quad Flat-pack No-lead [QFN], MicroLeadFrame�, etc] are essentially
Electronics Forum | Thu Jun 17 10:37:42 EDT 1999 | Brian Wycoff
| | | | | Our company is experiencing cracked caps at our pick and place operations. The caps are being placed onto epoxy dots for subsequent wave solder operations. At present, be have set the pressure of the head at 2 in/lbs. This being down from
Electronics Forum | Thu Jun 17 11:18:03 EDT 1999 | Ian Clelland
| | | | | | Our company is experiencing cracked caps at our pick and place operations. The caps are being placed onto epoxy dots for subsequent wave solder operations. At present, be have set the pressure of the head at 2 in/lbs. This being down fr