Electronics Forum: ipc610 (Page 12 of 17)

QFN welding problem by reflux oven 10 zones

Electronics Forum | Tue Feb 11 12:59:06 EST 2020 | astarotf

Hi Steve Thomas Effectively by IPC-610 standard specifies in the "content 8.2.13 Quad Flat Pack Plastic Package - Without Terminals (PQFN), Table 8-13, page 8-84" which depending on the class of manufacture notes 2-5 of the table, which in theory do

step stencil

Electronics Forum | Tue Jan 26 16:29:48 EST 2021 | charliedci

We will be exploring the exciting world of step stencils for the first time and I am looking for any advice from anyone using regularly. This direction is because we have large caps and soldered standoffs along with medium pitch LGA's and QFP's on sa

Big Holes (no Pun intended) in the IPC610D Criteria for Shrink/t

Electronics Forum | Fri Feb 17 13:10:34 EST 2006 | amol_kane

I have Immersion Ag and Immersion Sn LF boards that were waved using SAC305 alloy. I have a lot of tears/shrink voids in the waved connections. I am aware that SAC305 in wave has a propensity of shrink tears/voids due to the non eutectic property of

IPC 610 and J-STD Rev D - What's it all About?

Electronics Forum | Thu Mar 03 16:41:11 EST 2005 | davef

According to an on-line posting ... SMTA On-line Presentation Comparing Industry Standard Revisions March 9: IPC-A-610 with Regards to Lead-free Technology There have been extensive and significant changes to the industry standard IPC-A-610 with th

Re: Soldering to thru-hole lead to ground plane without thermal relief

Electronics Forum | Sat Jun 17 08:57:23 EDT 2000 | Chrys Shea

A few more tricks to try: - Got a hot air rework machine? You can get more controlled heat on the area and lower the risk of damage to the fab. I never got topside fillets un unrelieve ground planes until I went to convection preheat on my waves.

Re: S.P.O.T.T.

Electronics Forum | Wed Jun 12 11:26:50 EDT 2002 | pjc

Sean, Have you contacted Speedline Technologies applications enegineers? They have a lot of knowledge about SPOTT working with customers over the years to develop the process. I myself have experience doing SPOTT. I used Fuji GSP2 printers with overs

Solder Paste Volume

Electronics Forum | Fri Apr 06 09:02:20 EDT 2001 | CAL

FYI- Toe Fillets have not been required per IPC 610b/c (they are nice to have though). Remember before Solder paste inspection equipment The Solder powder type/size, stencil type, and apertures are what defined volume. The need has not been until rec

BGA voids

Electronics Forum | Thu Jan 16 04:02:18 EST 2003 | johnw

The IPC 610 actally conflict's with 7095 which give's a better indication of what's acceptable. I believe that IPC are reviewing both. Motorola did a bunch of work before basically showing that void's aren't that bad up to a certain size, I think pro

double sided reflow criteria

Electronics Forum | Tue Feb 04 18:46:01 EST 2003 | slthomas

"Use the pad mating to lead wetting area." If I get your drift, we're talking about the minimum lead area (assuming the pad has an area that's at least as large as the lead) required to be wetted by IPC-610. Hmmmm...that would take some calculation

Where to start with a new reflow oven

Electronics Forum | Mon Oct 13 12:28:11 EDT 2003 | Andrea

Up until this point, my company has been hand soldering all of our assemblies. We are a high reliability manufacturer and work to the IPC-610 Class three/ target. We just received a Reflow Solder Batch Oven. It is a small oven, a Gold-Flow GF-B. I ha

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