Electronics Forum | Fri Jan 14 16:58:20 EST 2000 | Dave F
Dave: You're probably correct about too much paste, given that your balling is congrigated near the center of the chips. Three things to consider: 1 Lower temperature profile @ front 3 zones 2 I've heard some stencil suppliers can plate addition
Electronics Forum | Fri Jan 14 17:24:08 EST 2000 | John Thorup
Yeah, it would be kind of expensive to replace all of your stencils but it's the only real answer. Be sure that all your new and replacement stencils have a home base or home plate shape for the passives. This reduces the paste volume near the cent
Electronics Forum | Fri May 03 07:53:16 EDT 2013 | hillview
lead free and leaded solder mix up or flux mix up.
Electronics Forum | Thu Apr 17 16:41:37 EDT 2003 | davef
60% ||||36% of ball area|| >36% ||Class2|| Accept|| Reject ||||45% of ball diameter|| >45% ||||20.25% of ball area|| >20.25% ||Class3|| Accept|| Reject ||||30% of ball diameter|| >30% ||||09% of ball area|| >09%
Electronics Forum | Thu May 09 12:06:06 EDT 2013 | pbarton
We run Zipatec 460's also. I presume that you are running Nitrogen? We have found that if the Nitrogen flow rate is too high into the conical nozzle collar it can be sufficient to disrupt the smooth flow of the solder as it runs down the wettable o
Electronics Forum | Fri Apr 05 18:22:18 EDT 2013 | Adam
We have two ZipaTec 460s Selective Solder Machines, one for Lead and one for Lead-Free. This morning we noticed the solder pot was covered in solder balls, and after asking the operator what they had run, the answer was "Nothing." The operator had al
Electronics Forum | Fri Apr 29 14:00:40 EDT 2011 | ppcbs
Our company is finishing up a design prototype for an easy to use re-balling fixture. 100% ball attach, and you can re-ball more than one BGA at a time. Initial investment will be in fixture cost, but you will be able to re-ball several chips in ar
Electronics Forum | Mon Nov 15 15:27:48 EST 2004 | davef
In creating your solder balls, consider printing or dispensing solder paste on the pads of the LGA and then reflowing the paste.
Electronics Forum | Mon Oct 27 14:15:47 EDT 2008 | hussman
So you passed a BARE board thru the oven and got solder balls?
Electronics Forum | Tue Feb 29 10:14:02 EST 2000 | Robert Hartmann
My company is just getting into the flip chip packaging arena. We are putting in a prototype/small volume wire bond PBGA line. We have some questions with regard to choosing solder balls and cleaning of flux. 1) Is there a formula for the shrink
.gif)
