Electronics Forum | Fri Oct 29 04:51:11 EDT 1999 | Wolfgang Busko
Hi Eom, no matter what size the crack is it�s a no-no and you should take any precaution to avoid this cracking. Ask your vendor if you are not sure which moisture level applies for your part. Follow the recommended handling specifications for moistu
Electronics Forum | Wed Apr 14 17:25:01 EDT 1999 | Stephen Oltmann
A company in Santa Clara California specializes in repair of fine pitch using automated inspection and repair equipment. They guarantee their work and include bake and dry pack. Go to http://www.sixsigmaservices.com/services.htm DOES ANY ONE KNOW
Electronics Forum | Thu Aug 23 11:55:21 EDT 2001 | wbu
TA, is there somebody out there who can bring on the right track according adequate materials for long term storage of assembled boards (at least 10 years)? It�s for spare parts for future service exchange. The units should be stored seperately and
Electronics Forum | Thu Aug 23 15:43:24 EDT 2001 | mparker
Have you considered vacuum package in ESD bags, just like the way the IC's are packaged? What about conformal coating for the units being stored? 10 years is a long time for End of Service life of a product. You may need to get accelerated life testi
Electronics Forum | Thu Nov 15 09:59:11 EST 2001 | Rob Fischer
Believe it or not, we use kid's markers like Crayola. Some colors come off more readily than others so you may have to experiment. We use it on aluminum so it may not be just right for you but it's an inexpensive test. Kind of made us happy when m
Electronics Forum | Thu Jan 03 02:35:18 EST 2002 | ianccy
Hi, I am trying to write SOP about the baking requirement of some CSP and uBGA components, the label on the packing said its usable within 72 hours and follow the MSL 4 condition, what does the MSL means? is it Material Safety Level? Has anything to
Electronics Forum | Thu Jan 03 02:36:04 EST 2002 | ianccy
Hi, I am trying to write SOP about the baking requirement of some CSP and uBGA components, the label on the packing said its usable within 72 hours and follow the MSL 4 condition, what does the MSL means? is it Material Safety Level? Has anything to
Electronics Forum | Mon Jan 21 01:49:18 EST 2002 | chinaren
hello, One of THT connector we used in production line is packed in ESD blister from the supplier, and then the blister is kept in ESD box. and now the supplier wants to change the ESD blister to plastic material( NON ESD) but still in ESD box. whet
Electronics Forum | Thu Jun 06 08:16:13 EDT 2002 | caldon
Jim- Sorry I can not offer advice on the Panasonic machine but do want to shed light on the Die and waffle pack issue. Take note that if the Die are loose in the pockets the balls or terminations could be damaged. The thin layer that the ball is atta
Electronics Forum | Tue Nov 05 09:21:18 EST 2002 | stefwitt
After all, you may want to consider a Flip Chip process. The chips are bumped with tiny solder balls while still on the wafer. You may present the bumped chips in Gel Pack, trays or Surftape to your Pick $ Place machine ( if capable for Flip Chip pl
