Electronics Forum: pass (Page 12 of 142)

Wavesolder for a second PASS

Electronics Forum | Mon Dec 31 08:59:36 EST 2001 | Don Adams

The second pass in the wave is pretty extreme and will probably aggravate the conditions which caused warpage in the first place. Areas to look for problems, The lay up of the boards at fabrication or the materials used can lead to warpage. Work wi

Water Quality Requirements to wash boards

Electronics Forum | Thu Apr 18 17:00:05 EDT 2002 | JamesL

We do cleanliness testing each morning using a Zero Ion tester. Our pass/fail number is set at 37ug/square inch NaCl. We are rarely above 10ug/square inch NaCl. We use Aqueous flux. Our inline washer has a prewash (70psi@130 degrees F), wash (?psi),

double side reflow soldering

Electronics Forum | Mon May 13 10:37:56 EDT 2002 | fmonette

The other important issue relates to moisture sensitive devices (MSD). If you have MSDs on the first side, you need to track the remaining floor life of the components on the partially assembled boards between the first and second reflow. Contrary to

BGA open joint

Electronics Forum | Thu Aug 05 21:47:35 EDT 2004 | KEN

Agreed. Joint failure can happen when un-bagging or durig box-build (at customer site). Careful handling should be used. In one case I had boards returned to me for evaluation and failure analysis. Too bad our site never built the boards!!! (jacka

Double-Sided BGA Process

Electronics Forum | Tue Sep 14 13:54:13 EDT 2004 | paul_boxboro

I'm with Chris' approach as a first effort. If you don't have any luck, consider using a high (reflow)temp solder paste for the first pass reflow, and your standard solder paste for the second pass refow. Years ago I had a similiar challenge with an

in-line testing

Electronics Forum | Fri Jul 08 13:43:20 EDT 2005 | pjc

I sell in-line ATE/ICT systems. They are designed to identify passed or failed boards coming off the tester(s). You can do so with a 90 deg. diverter and an extra magazine loader. The ICT machine knows which has passed and which has failed, so it com

Do you need to bake after parts are in the Dry Cabinet

Electronics Forum | Thu Jan 26 14:47:46 EST 2006 | james

Just wondering what others are doing as far MSD parts. We keep most of our parts in the dry cabinet before use. Most bags are openend and have passed the recomendation as far as mounting within a certain time. We have had defects with boards that

PBGA open connection

Electronics Forum | Tue Oct 03 09:23:55 EDT 2006 | kenscj

We are encountering BGA solder open connection. At Functional Test, the board failed. Debug guy diagnosed this BGA open connection (2 locations), by using multimeter. Under 5DX inspection, there is connection. Take the board for localised reflow at

First Pass Yields

Electronics Forum | Thu Nov 09 22:21:18 EST 2006 | John S.

I would think it would be more productive to compare DPMO. Particularly across different products. A simple board of 20 components should yield much higher than a complex board of 200 components. Also, some consideration should be given to the dif

How many times wave solder?

Electronics Forum | Thu Apr 19 11:45:34 EDT 2007 | Cal

Hi PeteB... I dont think you will find any Specs...but that I do not know. What I do know is it depends on the make up of your PCB and Components. Obvious haveing components that may be sensitive to heat the less you want to run or pass through. Re


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