Electronics Forum: thermal pad (Page 12 of 49)

28 pin QFN Pads.

Electronics Forum | Wed Sep 15 04:12:11 EDT 2010 | headlad

We had a similar problem so we shrunk the thermal and extended the pads. This allowed us to ensure solder resist was applied to the track in between. It fixed our problem.

Re: Thermals on BGA vias to power plane

Electronics Forum | Tue Mar 24 13:21:16 EST 1998 | Earl Moon

Should I use thermals or direct connects on vias from BGA pads to power planes. The via is connected to the BGA pad via a short 8mil trace. Thermals are safest. However, I have had no problems using direct connects provided parameters are capab

QFN PCB Pad no Drain Hole

Electronics Forum | Fri May 17 20:11:32 EDT 2013 | isd_jwendell

I am familiar with TI's documents on QFN mounting. I do not have an X-Ray machine, so I worry about excessive voiding that could happen with using the thermal vias improperly. As a general rule-of-thumb, I print paste with a 25% reduction on the ther

Thermals on BGA vias to power plane

Electronics Forum | Mon Mar 23 15:41:46 EST 1998 | Stuart Adams

Should I use thermals or direct connects on vias from BGA pads to power planes. The via is connected to the BGA pad via a short 8mil trace.

QFN soldering

Electronics Forum | Mon Nov 12 09:22:41 EST 2007 | devajj

BTW, The surrounded QFN fine pitch terminals > should have the normal aperture reduction of 7 % > in case of RoHS Senju solder paste. This works > for our Telecom customer. > > The vias in the > ground pad will be somewhat filled with solder >

Lead-Free SMD repair

Electronics Forum | Thu Jun 02 11:16:23 EDT 2005 | JH

I concern about the Through Hole soldering as well. Currently, we have encountered some problems of Multilayer from Through Hole soldering. The root-cause is probably related to PCB Finish, machine setting, Thermal relief Pad or hole and something e

0402 tombstones

Electronics Forum | Thu Apr 16 09:54:12 EDT 2009 | davef

We know virtually nothing about your process, but here's some guesses: * Turn-off the nitrogen * Change from Sn63 to Sn62 * Change to a low-tombstone paste * Change the thermal recipe: slower ramp, longer soak * Do a better job of placing components

Samtec Searay 500 pin connector solder wicking issue after reflow

Electronics Forum | Wed Jan 15 11:53:40 EST 2020 | avillaro2020

As far as the large thermal gradient I have on my thick and thermal heavy board, I've done quite a bit to minimize the gradient but not successful. it's like one pad is connected to a signal while the other pad is connected to ground, you can't bring

Thermal Relief BGA footprint design - traces - reflow

Electronics Forum | Mon Jun 02 19:41:41 EDT 2008 | operator

Is there some good resources (.pdfs, websites, articles) that someone can point me to regarding design for bga footprints? I need to brush up on thermal relief design for bga footprints. I got a customer whose bga lands are masking defined on top of

Making a BGA stand up

Electronics Forum | Mon Jan 13 21:52:16 EST 2003 | davef

Haaaaaa!!!! You contractors get all the fun don't ya??? Consider: * Replacing the balls on the corners of the devices with balls composed of a "hard solder", yano something like 90/10. * Shimming to prevent excessive collapse of a heavy BGA during


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