Electronics Forum | Wed Aug 12 00:01:56 EDT 1998 | Peter
I have a customer who is transitioning from 100% thru hole boards to designing boards with smt components. We gave them our basic DFM guidelines and they have laid out 2 boards following these guidelines. When I saw the result of their first pass, I
Electronics Forum | Thu Aug 06 12:49:41 EDT 1998 | justin medernach
| I am looking for advice or information from anyone about the possible reliability problems associated with epoxy on solder pads of discrete devices. Will the epoxy expand and lift over time, Will there be adverse reaction between the solder and the
Electronics Forum | Tue Jul 28 16:13:45 EDT 1998 | Steve Gregory
| Hello everybody. | Remember I posted some questions on the smtnet regarding placing the thru hole connector using paste and reflow(pin in hole). I have able to accomplish the process succcesfully.....but I have a problem. The boards are failing at
Electronics Forum | Thu Jun 25 08:30:38 EDT 1998 | Earl Moon
| I have a single-sided board with test vias that pass through the board. The test vias are pasted and reflowed with the SMT components on the top side. When the boards are wavesoldered, the solder coverage on the vias is spotty. Some will sold
Electronics Forum | Thu Jun 25 09:29:01 EDT 1998 | Henry Lee
| | I have a single-sided board with test vias that pass through the board. The test vias are pasted and reflowed with the SMT components on the top side. When the boards are wavesoldered, the solder coverage on the vias is spotty. Some will so
Electronics Forum | Wed Jun 24 14:08:34 EDT 1998 | Henry Lee
I have a single-sided board with test vias that pass through the board. The test vias are pasted and reflowed with the SMT components on the top side. When the boards are wavesoldered, the solder coverage on the vias is spotty. Some will solder
Electronics Forum | Thu Jun 25 08:30:39 EDT 1998 | Earl Moon
| I have a single-sided board with test vias that pass through the board. The test vias are pasted and reflowed with the SMT components on the top side. When the boards are wavesoldered, the solder coverage on the vias is spotty. Some will sold
Electronics Forum | Thu Jun 25 09:29:01 EDT 1998 | Henry Lee
| | I have a single-sided board with test vias that pass through the board. The test vias are pasted and reflowed with the SMT components on the top side. When the boards are wavesoldered, the solder coverage on the vias is spotty. Some will so
Electronics Forum | Tue Jun 16 07:26:07 EDT 1998 | Sherry
Going, going, gone, but back? It must be early, this post is quite confusing, ok I'm having a blonde moment. Sounds like you're going to be quite busy, I wish you well! Also, wanted to let you know...my email has been down Once they get it operatio
Electronics Forum | Mon Jun 08 11:39:28 EDT 1998 | Earl Moon
| How do I mechanically/visually inspect BGA devices when they are soldered to a PCB for possible solder, or other, defects as a first step before part removal and further analysis? I have had board failures due to poor soldering--I think? I can pr
