Electronics Forum: stencil (Page 117 of 541)

SMT Line Test

Electronics Forum | Wed Jan 16 13:09:41 EST 2002 | jhingtgen

Yannick, I have been involved in a stencil consortium that looked at stencil design, technology, and paste as variables. This material will be presented at APEX 2002 in San Diego next week. This work was done by Rochester Institute of Technology i

Rippling effect of stencils

Electronics Forum | Mon Feb 18 10:28:13 EST 2002 | caldon

I have printed 1000's of boards with dozens of stencils with TA permalex blades and have not had the issue you speak of. Sorry I was not much help. Cal

Rippling effect of stencils

Electronics Forum | Fri Jan 10 15:02:03 EST 2003 | John

Hi. I am familiar with the Transition blades. Normally, when there is metal to metal contact, as in the squeegee-stencil situation, there will be scratches, or a "brush pattern". Sometimes it takes the pattern of the high profile surface elements u

Filling via holes during the reflow process

Electronics Forum | Mon Mar 04 11:08:56 EST 2002 | Matt Kehoe

We have a customer that desires to have their via holes plugged with solder after assembly. Is it possible to add the via holes to the stencil and print paste into them and expect them to plug? If so, how much paste? One to one on the stencil opening

Cleaning SMD Adhesives

Electronics Forum | Tue Jul 23 21:22:10 EDT 2002 | davef

http://www.petroferm.com/PTF-053/pdf/tds/petroferm/hydrexactds01-01.pdf ... expect that we use a spatula and stencil wipes [JNJ???] to prep the stencil before cleaning.

Shrinkage in paper phenolic pcbs

Electronics Forum | Thu Aug 22 22:58:40 EDT 2002 | craigj

Are having problems with cheap paper phenolic pcbs that appear to have shrunk. That is they no longer match the stencil (stencil is correct). Some people seem to think this is normal, is there an industry standard out there that says what is reasonab

QFP IC open solder

Electronics Forum | Sat Sep 28 05:30:44 EDT 2002 | ivanchu

Stencil cleaning process is taking by machine every 15 boards. We are using wet, vaccune, Dry, Dry cleaning process. The aperture of the stencil is fullfil the aspect ratio.

type 3 vs type 4 paste

Electronics Forum | Thu Nov 07 10:59:11 EST 2002 | pjc

IPC-7525 "Stencil Design Guidelines" is a good reference document to have. Here are notes from a Tessera, (a major mBGA mfg.), study- "Application Note Solder Stencil Requirement for mBGA" The stencil aperture is to be square, equal in size to the l

Fine pitch paste release problems.

Electronics Forum | Tue Dec 17 09:10:57 EST 2002 | Stephen

Are your stencils electropolished? I still haven't used an electroformed stencil, but I understand they can be worth the extra money, because of the better release characteristics.

Stenciling chipbonder.....

Electronics Forum | Wed Jan 22 15:22:53 EST 2003 | davef

Hey "Dispenser Boy" does this mean we can have your machine? ;P I'll be out to supervise the packing with a Hook in my hand. Poke around the fine SMTnet Archives to get started on aperture design. 7525, Stencil Design Guidelines is pretty much of

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