Electronics Forum | Tue Mar 20 05:26:32 EDT 2007 | CL
Hi Chrissie, BGA Rework from one CM's view: 10% process problem (printing, reflow, voids, etc) 10% component failure (no other problem found) 80% "The board does not work therefore it must be the BGA" This, of course, is exaggerated. My point bein
Electronics Forum | Wed Mar 21 10:30:15 EDT 2007 | ck_the_flip
Chrissie also says, "Before anyone suggests it - redesign of the boards is not an option!!", so I'm assuming that re-design means panelization too. She's probably sitting on thousands of these unpanelized PCB's in stock. Now, for the future, as Ste
Electronics Forum | Tue Apr 03 15:48:35 EDT 2007 | Cmiller
If the Bliss carts would help you can cut some money out by buying aluminum bakers carts at your local restaurant supply house for less than $100/each and then buy ESD trays from another local source (Bliss is rather pricy). You will have to hang a c
Electronics Forum | Wed Mar 21 15:33:16 EDT 2007 | pjc
Not all OSPs are created equal. Some companies use N2 in their reflow oven to minimize oxidation during reflow. This is for double sided reflow and if wave or selective solder will be done after reflow. Get extra boards from the vendor to test. Run t
Electronics Forum | Fri Mar 23 08:22:35 EDT 2007 | oldsmtdude
I've used standard Nikon for years. We evaluated the Mantis and while first impressions were positive but with continued use EVERYONE chose to move back to the standard eyepiece. A lot depends on what size components you're dealing with - when you s
Electronics Forum | Fri Apr 06 16:36:39 EDT 2007 | mika
Ah, I almost forget (forgot?) to mention that according to the Gerber files (which is the info we send to the PCB-house) the PCB land pattern for this LGA-36 0.35mm rounded pads and the boardhouse cannot achieve this. I understand them; 0.35mm pads,
Electronics Forum | Sun Apr 15 19:55:52 EDT 2007 | darby
Mika, I think you will find all board houses "clean up" their customer's files to suit their shop. Depending on the severity of the change; I think they take the attitude that they will not inform you to avoid an argument going backwards and forwards
Electronics Forum | Mon Mar 26 07:38:26 EDT 2007 | davef
The temperature that will melt solder holding top side SMT components during wave soldering depends on the alloy of that solder. So, for example, you'd expect: * Near eutectic SnPb solder to melt around 215*C. * LF to melt around 240*C. It's common
Electronics Forum | Mon Mar 26 20:04:04 EDT 2007 | Amy
Yes, I have tested some boards, and found that most QFPs which near the via will have the higher temperature. One of my customer requirement is to have the temp less than 200 deg C for top side. We were using the hi temp wire to solder the QFP's for
Electronics Forum | Thu Mar 29 07:22:13 EDT 2007 | davef
This does not seem to be a sales pitch. It seems like Mr Johnson was trolling the web and came across a SMTnet Archival posting on the pointlessness of burning product life doing HASS and wanted to engage a conversation on his issue with that commen