Electronics Forum: pass (Page 122 of 142)

Re: Setting up solder material evaluation (suggestions?)

Electronics Forum | Mon May 10 08:00:14 EDT 1999 | Timothy O'Neill

I am about to embark on an effort to evaluate 3 different solder material suppliers and their recommended materials for our assembly process, in an effort to find the best supplier/material. We do mixed technology, with NOCLEAN chemistry so

Re: Fond Farwell II (Why I hate aggresive sales and marketing)

Electronics Forum | Mon Apr 19 13:05:31 EDT 1999 | Bob

Steve, Like you, I am sick, sick, sick of marketing. I can't go on the Internet, to a ball game or my local 7-11 without being bombarded with marketing. 7-11? Would you belive I went there to buy a Sunday paper yesterday and now they have a 27" mo

Re: Solder FINES vs. Solder Balls

Electronics Forum | Thu Apr 15 12:58:59 EDT 1999 | Chrys Shea

Can someone explain the difference between solder "fines" and solder balls? Is there an official specification where "fines" are defined? What is the spec for "fines"? I consider "fines" individual unmelted metal spheres that are foun

Re: Suspect BGAs

Electronics Forum | Wed Mar 17 02:14:39 EST 1999 | Joe

We are having a small number (~2%) of our boards pass our manufacturing diagnostics, fail once they reach the customer, fail when they get back to us and then start working again after handling them for a short time. We have eliminated a lot of

Re: white residue

Electronics Forum | Wed Feb 10 12:52:21 EST 1999 | Dick Casagrande

I'm getting in a little late on this but my 2 cents is: We have been using no-clean flux for a few years now but up till last month were still cleaning (the white residue) our boards (all thru hole). Finally did some investigation and found the flux

Re: CSP Assembly- SIR Test

Electronics Forum | Thu Dec 31 14:20:35 EST 1998 | Michael Allen

Kelvin, Yes, we're referencing the same spec. I performed the test under the Class 2 conditions (except that I used a 100V bias rather than 50V...but my water-washed microBGAs still passed). Regarding the omegameter test: we have this instrument,

Will A Few Failed Solder Joints Make Me RoHS Non Compliant?

Electronics Forum | Thu Feb 19 11:47:06 EST 2015 | dad23honu

I had someone in another forum tell me that my assembly would fail if I had a few solder joints over the 1000ppm RoHS threshold, with all other solder joints within spec. So, I followed up with this illustration. Please let me know what you think.

Re: Solderability on Immersion Gold

Electronics Forum | Thu Mar 02 16:06:32 EST 2000 | eLDON sANDERS

Gentlemen, I too have been atacked by that "soldering to gold" and will add my 2 cents. I also had parts that would pop off the board when the fillet looked perfect. After lots of pain, experimentation, and sleepless nights, I solved it through a

Re: Solderability of BGA and PCB

Electronics Forum | Mon Nov 20 21:02:46 EST 2000 | Michael Psrker

First question I have for you is: Are you assuming that standard precautions are in place at your facility to minimize moisture content i.e. air- deionizers, vacuum sealed packaging, humidity control in storage and manufacturing? You do not mention

Re: Solderability of BGA and PCB

Electronics Forum | Mon Nov 27 17:47:23 EST 2000 | Dave F

Gyver: Lemme take a wack [if you�ll excuse the expression, given direction of the later discussion] at your questions. Q1. Will the baking of BGA or PCB cause more oxidation before the SMT process? A1. It certainly will not cause less oxidation,


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