Electronics Forum | Thu Jun 06 09:46:28 EDT 2002 | davef
Most paste supplier recommendations seem to work fine in the locale of the printer. Search the fine SMTnet Archives for recommendations on the range of control for temperature and humidity in a assembly shop.
Electronics Forum | Fri Oct 25 12:23:49 EDT 2002 | yngwie
Hi Experts, I'm facing short problem with BGA at SRT rework in one particular BGA. It is BGA, with a metal piece at the center like a coin. The BGA is located in between two high profile press fit connectors and the short always observed at the si
Electronics Forum | Tue Apr 01 19:36:02 EST 2003 | iman
from my humble experience : 1) check if there is nickle contaminate in the gold bath? shd have report data from the PCB fab house. 2) check if your production did 48hr bake at 125degC, IF the BGA did not come in its "original" MSD cozy packaging.
Electronics Forum | Mon May 05 03:53:41 EDT 2003 | praveen
Do not 'ON" the nitrogen during reflow. If the pad of the chip is bigger then reduce the pad width from out side. Reduce the ramp rate at any point of the profile below 1 deg c/sec.
Electronics Forum | Mon May 05 03:53:47 EDT 2003 | praveen
Do not 'ON" the nitrogen during reflow. If the pad of the chip is bigger then reduce the pad width from out side. Reduce the ramp rate at any point of the profile below 1 deg c/sec.
Electronics Forum | Wed Jul 30 23:16:01 EDT 2003 | praveen
The profile is enclosed.The PBGA is 37x37 mm.I am keeping the gap about 4-5 mm.The profile meets the solder paste spec.Peak temp is 211 deg C,Above melting point 77 sec. rate of heating
Electronics Forum | Tue Aug 05 17:19:18 EDT 2003 | Kris
Hi, Have you tried increasing the vibration at the main wave or using a chip wave? try increasing the temperature of the solder by about 10 Deg C.
Electronics Forum | Sat Jan 15 23:58:24 EST 2005 | Chua
Could you advise what is the min and max peak temperature for this process. Presently, my leaded peak temperature at the range of 215 - 225 deg.C And how do I know that the solderability is at optimal. Appreciate your help......
Electronics Forum | Thu Feb 03 10:01:08 EST 2005 | Philj
Try heating a blank board on a hotplate to 183 deg C. with a board this thick, if the layer construction is poorly balanced, it may bend enough in the region of the ceramic capacitor for the soldered joints to crack it on cooling to ambient.
Electronics Forum | Fri Feb 18 11:30:27 EST 2005 | austinj
Thanx aj and Russ. I will verify my ramp up/down degC/sec and the soak zone peak temp. Fluxes could be burning off prior to activation. I have found access to an old thermal data logger to help verify the Heller thermocouples. I will post updated fi