Electronics Forum | Mon Jan 15 11:41:56 EST 2007 | davef
Questions are: * Does the component take solder when you dip it in the solder pot to test the solderability of the leads? * Can you get full barrel fill when wave soldering a bare board? * Is your flux reaching the top of the board through the hole b
Electronics Forum | Thu Apr 12 00:25:25 EDT 2007 | raychamp007
Thanks davef! We found some SOIC & QFP with all leads having toe down problem. The heel fillet unable extend to the mid point outside bend. Do you have solutions for the problem? I have a question: How about the normal gull wing lead which is flat &
Electronics Forum | Mon Apr 16 09:12:23 EDT 2007 | davef
Standard for appearance: J-STD-001 and IPC-A-610 committees eliminated the requirement that solder connections be "bright and shiny". Certain solderability protections; such as Au, NiPd, NiPdAu; can affect the surface texture of a solder connection,
Electronics Forum | Thu Jul 05 22:56:53 EDT 2007 | gyverlo
Hello Sirs: Recently we are having an issue with environmental stress (high humidity or moisture), so we decide to apply conformal coating on our motherboard to protect via holes. According to IPC-A-610D, spec of thickness for type AR is 0.03~0.13 m
Electronics Forum | Tue May 06 15:33:36 EDT 2008 | operator
I know IPC-A-610 RevD has requirements for Gold Fingers and solder contamination. Is there any such requirements for Gold Mounting Holes, Gold Pressure Fit Socket Lands (SMT pads), Exposed Gold Traces ? Wouldn't these all be considered "critical cont
Electronics Forum | Tue Dec 02 07:56:40 EST 2008 | realchunks
Wow, rocket science with Nasa specs! I like it. I don't see the trick question here, so I'll continue.... IPC simply states over hang of round or flattened (coined) leads is acceptable (class 1, 2, & 3) if it "does not violate minimum electrical c
Electronics Forum | Mon Jan 26 10:15:51 EST 2009 | john123
Can anyone help me determine the acceptability level for lead deformation (see attachment). The outer two leads on the left side were bent during the pick and place centering operation. I've looked in the IPC-A-610 book and could only find informa
Electronics Forum | Fri Mar 13 17:09:49 EDT 2009 | kmorris
We have found very small solder deposits on the gold fingers of some PCI boards after assembly at our CM. In the IPC-A-610, it says that no contamination or solder is allowed in the critical contact area. 1. I'm looking for feedback on what others
Electronics Forum | Tue Mar 17 07:32:10 EDT 2009 | davef
Solder ball acceptance: IPC-A-610, 6.5.3.1 & 12.4.10. Solder balls: 5 ball system: * No more than 5 balls per square inch (100mm2) allowed * Solder balls can not be greater than 5 mil (0.005in) (100um) * Solder balls cannot be less than 5 mil (100um)
Electronics Forum | Wed May 20 17:56:51 EDT 2009 | dyoungquist
I have attached a pdf showing the dimensions for the QFN we placed. First, The pins on the part are not only on the bottom side but also wrap around to come up each of the 4 sides of the part as shown in the side view in the attached pdf. This i
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