Electronics Forum | Tue May 06 21:35:27 EDT 2014 | davef
Indium recommendations: 0201's: * Stencil Opening = 11mil x 16mil rectangle * Foot Print = 12mil x 15mil rectangle * Stencil Thickness = 5mils * Spacing = 9mils Note: The most common stencil being utilized, is the laser cut electropolished, and in so
Electronics Forum | Thu Jul 01 13:57:57 EDT 1999 | Kris Wiederhold
| Dear guys, | | I have some problem on assembling micro-BGA with solder paste (63/37). The micro-BGA we assmeble is 0.75mm pitch and with 45 pin (solder bump is 96.5/3.5Ag). The stencil is a laser-cut stencil with 5 mil thickness. We are now usin
Electronics Forum | Fri Mar 06 10:30:46 EST 1998 | Ron Costa
| | | Hello everyone! | | | Does any know anything about bare board size variations? | | | Is there a spec. or tolerance? | | | I'm running small lots of boards and during the screen printing process | | | I find that I cannot paste each board perfec
Electronics Forum | Mon Oct 07 23:04:05 EDT 2019 | SMTA-David
Hi, I have a semi-Auto paste stencil machine and use laser cut stainless stencil with T4 paste. When I start pasting boards the paste covers the pads and is well defined. Throughout the job we have been having some issues with feeder on pick and pl
Electronics Forum | Wed Jan 20 20:29:17 EST 1999 | Tony A
| | Bernie, Steve Gregory approach is the simplest solution. But,If you ever get yourself into a real bind and need an array of holes added and the cost of a new stencil is astronomical. Approach Hamlet at BeamOn. I have seen him add and enlarge hole
Electronics Forum | Wed Aug 07 01:41:27 EDT 2019 | orbitcoms
Hi I am having trouble getting solder bridges on TQFP-100 (0.5mm pitch) components. The boards are pasted on semi-auto printer using laser-cut 0.12mm stencil and SN63 NC257-2 T4 paste. The components are placed using Samsung CP40LV and tghen reflow
Electronics Forum | Thu Jun 24 15:44:12 EDT 1999 | Earl Moon
| | Dear guys, | | | | I have some problem on assembling micro-BGA with solder paste (63/37). The micro-BGA we assmeble is 0.75mm pitch and with 45 pin (solder bump is 96.5/3.5Ag). The stencil is a laser-cut stencil with 5 mil thickness. We are no
Electronics Forum | Wed Aug 18 15:20:25 EDT 1999 | John Thorup
| Hi, | I'd like to ask some tips about the merits and shortcomings o | of both screen printer and stencil printer. For small quantity and highly mixed usage, which type of printer is suitable to our | application? | The boards contain no BGA and
Electronics Forum | Tue Sep 21 09:33:30 EDT 1999 | Scott Davies
| | | My stencil thickness is 6 mil and we got qfp's with fine pitch. | | | how many percent should i reduce my stencil aperture using a 6 mil stencil for 0.5 mm pitch and 0.4 mm pitch ? | | | | | | thanks | | | | | We use 6 mil lasercut stencils w
Electronics Forum | Thu Jun 24 13:12:15 EDT 1999 | MD Cox
| Dear guys, | | I have some problem on assembling micro-BGA with solder paste (63/37). The micro-BGA we assmeble is 0.75mm pitch and with 45 pin (solder bump is 96.5/3.5Ag). The stencil is a laser-cut stencil with 5 mil thickness. We are now usin
