Electronics Forum | Thu Jul 15 07:08:29 EDT 2004 | pcbrown
Basically, it's a tilting problem of certain devices. Usually with axial by-pass caps tilting, which pulls the lead up through it's mounting hole. Other problems with components with leads cut to lenght to eliminate post-wave trimming. All suggestion
Electronics Forum | Thu Apr 17 07:51:19 EDT 2014 | emeto
Opens are on the device to the PCB - mainly on the edges, that makes me think I get some kind of warping,but even if I bake parts and boards doesn't help. We also tried different reflow profiles - same results. I hear that some people use dip fluxers
Electronics Forum | Tue Apr 14 15:50:45 EDT 1998 | Bob Barr
Justin, Thanks for the response to my dilemma. For once it's not just me! The parts seem perfectly solderable, but I will try the modification to the profile you suggested. I wonder if the retention clips may be letting loose from the holes they a
Electronics Forum | Fri May 28 07:37:52 EDT 1999 | Steve Cheung
Yes l know this problem keeps cropping up on the forum but l've missed some of the follow-ups. Our problem is that the lifting only occurs on 3% of production so actually detecting an improvement is difficult. We're actually having to inspect 144 p
Electronics Forum | Wed Oct 03 23:59:44 EDT 2018 | gaintstar
Flason SMT problem solving: http://www.flason-smt.com/new/PRINCIPLE-OF-SURFACE-MOUNT-PROCESS-SMT-PROCESS.html http://www.flason-smt.com/new/Printed-Circuit-Board-PCB-Price-Estimator.html http://www.flason-smt.com/new/Printed-Circuit-Board-Solder-res
Electronics Forum | Tue Aug 21 21:39:19 EDT 2001 | davef
1) why is No-clean (NC) the preferred process, for BGA mounting by SMT? Probably the same reason NC is the preferred process for mounting non-area array SMT components. 2) why is water-soluble (WS) not a hot choice? There�s not reason not to use
Electronics Forum | Fri Jul 30 17:13:30 EDT 1999 | Dave F
| | | Looking for solder paste specification limits which have reliability data to support them. Currently, we are looking to define the min/max volume necessary to ensure a good joint on CBGA, PBGA, and Micro-BGA's. Any information will be greatly
Electronics Forum | Tue Oct 05 03:49:04 EDT 1999 | Chris May
| Hi everyone, I need some help on the whole process of double sided surface mount. We have been doing surface mount for about 3 months and we're getting ready to take on our first doule sided board. I just need some step by step process regarding so
Electronics Forum | Fri Oct 02 14:38:45 EDT 1998 | Michael Kicinski
| Konichi wa "SMT-netter" sans... | I've been on a fruitless search for some board mount, micro BGA sockets...I don't think they're out there yet, but I don't know for sure. | Found a lot of test and burn-in sockets for CSP's (at more than $1,000 pe
Electronics Forum | Thu Sep 10 09:47:15 EDT 1998 | Earl Moon
| hi, | 1206 capacitor with silver/palladium termination is mounted onto a ceramics substrates. Bonding is achieved through conductive epoxy. | We discovered that the epoxy cracked and this caused missing capacitor. We had tried different grade of e
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