Electronics Forum | Mon Mar 16 01:57:54 EDT 2009 | ivalerio
Hi Guys Could you give me the standard criteria that is being followed for solder ball in PCBA. I am aware that we have an IPC standard but still that is generic in nature. I need a one that is applicable for automotive industry.
Electronics Forum | Tue Sep 18 10:29:21 EDT 2012 | davef
Sorry. I don't see any solder balls. To me, it looks like the solder wetted the pad and then pulled back. It's called dewetting. It's a defect. Ask your supplier for a SEM analysis. I'm interested to know what he / she says.
Electronics Forum | Tue Jun 25 09:55:25 EDT 2013 | bandjwet
We are looking for a recommendation for a company that can perform solder ball inspection on BGAs. The devices are in trays and the the challenge is the ultra fine pitch (0.4mm) and ball size (0.25mm diam). We are looking for ball diameter and coplan
Electronics Forum | Tue Mar 03 03:11:57 EST 2015 | vb7007
Hi I also forgot to mention, top side is reflowed first at SMT. Tenting vias is good option. we are looking into it. Can you please also suggest any solution to avoid solder balls at bottom side in other places than vias. Thanks
Electronics Forum | Mon Nov 18 04:04:43 EST 2019 | ramesh_10377
hi initially, as per PCB design and gerber file of PCB we got 5 mil stencil, during process observed lot of solder balls (70-80%), then we decided to go for 4 mil stencil with c-cut. now the problem is reduced and still solderball exists which is a