Electronics Forum | Thu Jan 10 18:32:20 EST 2008 | stevek
Our layout guy recently started making land patterns with the corner lands oversized. These are for leadless and various flatpack parts. He claims this is to improve manufacturing. I had seen a few boards with this just as I got out of the CM worl
Electronics Forum | Thu Oct 02 12:22:26 EDT 2008 | JerryS
Hello Ok there is not much info here. What you have to mae sure of is several key factors. 1. Have you entered the correct stencil thickness. 2. Are you using the stencil gerber (not the paste layer) The paste layer is usually not adjusted for ap
Electronics Forum | Fri Dec 12 11:02:20 EST 2008 | patrickbruneel
Greg, I totally agree with you that machine settings are very important in wave soldering and soldering in general. I disagree that lead free alloys can produce wetting like in the attached picture (leaded alloy). Lead free alloys have a much higher
Electronics Forum | Thu Jul 02 13:10:22 EDT 2009 | kpm135
On first glance it looks like those particular pads were not attached to any traces. If I had to guess I would say that your rework profile got hot enough to melt away the glue holding the pads to the board and they came away with your part when you
Electronics Forum | Thu Feb 25 20:25:16 EST 2010 | dean
Good question, the answer as of right now is yes. Our machine is only able to go down to 0402 parts before the surface tension of the solder begins to cause issues with maintaining the placement position of the part on the nozzle. However, we are dev
Electronics Forum | Sun Mar 20 15:05:28 EDT 2011 | floydf
We are preparing to run a 2-sided board with BGAs on one side and passives on the other side. We have two schools of thought on which side we should run first. One school says run the passive side first, then run the BGA side and the surface tensio
Electronics Forum | Fri Nov 11 01:48:05 EST 2011 | julien
Thanks guys, But for the cleaning process we already have a chemical product to clean flux residues and other contaminant. But it seems that we can't rinse properly under low stand-off components and we find trace of our chemical under some ceramic c
Electronics Forum | Mon Aug 13 09:49:35 EDT 2012 | rjlatz
I just got back from a visit to our PCBA manufacturer. We have good flowthrough on the PTH, but solder skips and bridges on the SMT SO IC's. We have correct orientation and robber pads, but the results are still the same. I noticed the wave shape is
Electronics Forum | Wed Feb 20 18:21:49 EST 2013 | caurbach
A question for all you wave experts out there: We run our wave with a constant flow over the back plate. I know it's recommended that we set the back plate so that the solder sits just at the top of the back plate with surface tension keeping it fr
Electronics Forum | Mon Apr 17 10:21:21 EDT 2017 | dontfeedphils
So I'm starting up a conformal coating process from scratch (again, although it's been about 10 years) and I'm looking for the best option for verifying thickness. I plan on going the "coupon per setup" route which will encompass both our manual spr
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