Electronics Forum: thermal pad (Page 13 of 49)

Vacuum Reflow Oven

Electronics Forum | Thu May 03 17:33:20 EDT 2018 | dleeper

Solder paste selection can have a huge impact on size and quantity of voids. Talk to a few suppliers and ask for their recommendation on low voiding formulas. Pick a few of your top candidates and then perform a DOE to see who has the best result. S

Cracked SMT Capacitors

Electronics Forum | Wed Jun 13 21:31:27 EDT 2001 | davef

Lotsa ways to bust caps. First: placement force; Second: thermal stress; Third: poor pad design. Forth: then, ummm maybe the cap supplier. Please describe the crack in more detail. Where does the crack start? Where does the crack go?

Soldering Issue in Sensor component

Electronics Forum | Fri Dec 27 14:27:40 EST 2019 | slthomas

We switched to a REL0 T3 paste, Amtech LF-4300. It wets the castellations more consistently. I believe that in our case it was more of a plating wetting issue with the parts, but yours sounds more like a pcb finish or thermal issue. That larger pad

Making a BGA stand up

Electronics Forum | Fri Jan 17 22:08:31 EST 2003 | iman

try using thermal pads under the area without the balls. yeah, its a pain but we did it before for lot run of 500pcs BGA. Not feasible for mass production run, you say? well, thats why there's a thing called DMF, and why its the designer guys res

LGA36 6.5 x 3.5 mm

Electronics Forum | Sat Mar 24 03:06:55 EDT 2007 | aj

Hi Mika, We came across some difficulties with this type of device a couple of years back . After the proto run we needed to touch up the outside fillets to get stability and product to pass test. ( even though the manf. stated that there is no fill

Aperture Adjustments and Etch Compensation on Arrays

Electronics Forum | Thu Mar 28 15:53:49 EDT 2019 | SMTA-Jon

As a CM, we don’t have a lot of input on the PCB layouts we receive. Some engineers/software packages output the paste layer 1 to 1, some do an across the board reduction, and some set each part up individually with different reductions per footprin

QFN soldering

Electronics Forum | Sat Nov 10 22:45:06 EST 2007 | realchunks

1. What is the body size? Who cares. 2. What is the pitch? Doesn't amtter. 3. What is the terminal size? Doesn't matter 4. What is the land pattern size? Really doesn't matter. 5. The Thermal square pad in the middle, with how many vias? If you

BGA rework

Electronics Forum | Thu May 06 18:48:22 EDT 2004 | Dreamsniper

SUMMIT 750. My yield is 75%-98%. And they all depend on the pad design, stencil, paste, operator, thermal profile, etc. I have 98% yield on some of our products with good pad design. Process is easy to control. Dreamy

Oven profiles. Linear vs. Saddle?

Electronics Forum | Fri Oct 10 20:56:50 EDT 2014 | jlawson

Main issues... Pad Design Thermal Mismatch Design related to pads effected Moisture and out gassing in substrate / part terminations can move parts slightly during preheat prior to liquidous this get position shift ( smaller the parts more an issue)

qfp reflow problems

Electronics Forum | Thu Apr 15 17:06:08 EDT 2004 | russ

What are your temps at the locations that you are having trouble with. We cannot tell anything by the zone settings of an oven. We need max temp, how long above liquidous etc.. a lot of times this symptom is due to too long of a soak at too high o


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