Electronics Forum: pass (Page 124 of 142)

Info on OSP PCB�s

Electronics Forum | Fri Jun 01 12:23:22 EDT 2001 | medernach

I've had good and bad experiences with OSP's. First of all, ask yourself, "Why use an OSP?" If you don't need it, don't use it. Solderability is dependent upon the number of thermal passes (the fewer, the better), the thickness of the coating, the

J-STD-002 and -003 solderability testing...

Electronics Forum | Sat Jun 30 11:03:29 EDT 2001 | davef

Nice to have you back on SMTnet. Some of the newer folk have missed-out on the solid contributions you�ve made to the Forum. The chicken wire cleaning basket was a classic!!! [It�s a shame that the folk at SMTnet can�t recover those files.] We bu

Can the old datecode Entek PCB be converted to HASL ?

Electronics Forum | Thu Jul 05 19:39:19 EDT 2001 | davef

I had forgotten that it was you that was on the Sipad adventure. [But then again, who can keep track of yer aliases? ;-)] You just go from one adventure to the next. Expanding On Dave�s Hi-Test Flux Method Theory � PASTE: Yes, contact your favorit

Inspection Methods

Electronics Forum | Mon Jul 23 00:59:18 EDT 2001 | mugen

Dave. F. Hmmmzzz.... Thats interesting, coz as a contract manufacturer, we try to optimize processes asmuchaspossible.... simple...yeah! that's the word "Simplify".... We found that if you layout a production line, assume x10 operators, and one si

Inspection Methods

Electronics Forum | Mon Jul 23 01:00:40 EDT 2001 | mugen

Dave. F. Hmmmzzz.... Thats interesting, coz as a contract manufacturer, we try to optimize processes asmuchaspossible.... simple...yeah! that's the word "Simplify".... We found that if you layout a production line, assume x10 operators, and one si

Contamination test

Electronics Forum | Mon Jul 30 21:03:44 EDT 2001 | davef

You should specify the level of res based on the effect of the res on the end-use of the product. J-STD-001 defines cleanliness requirements for ALL flux types, including water soluble and no-clean that you mention. 1 There is no equivalency betwee

Re: Poor solder joints on QFP 100's

Electronics Forum | Mon Dec 13 19:34:09 EST 1999 | Steve Thomas

Thanks, gentlemen. All points well taken, and some hit pretty close to home. Our pick-and-place programmer assures me that coplanarity isn't the issue because the machine won't (or can't) place parts beyond an acceptable criteria. It's an Amistar

Re: Solder Mask IPC Standard

Electronics Forum | Sun Oct 10 17:40:50 EDT 1999 | JohnW

Is there an IPC Standard stating the max. number of times that a PCB can pass through a reflow or wavesolder machine without having solder mask breakdown. PCB is FR4 Solder Mask is LPI Reflow and W/S Profile = Standard

Re: More informations on water clean for CSP/BGA package

Electronics Forum | Wed Oct 06 12:03:12 EDT 1999 | Graham Naisbitt

Hi, Help! Could anyone help to enlighten me on this? Question: If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a n

Re: More informations on water clean for CSP/BGA package

Electronics Forum | Wed Oct 06 23:36:28 EDT 1999 | karlin

Hi, Help! Could anyone help to enlighten me on this? Question: If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z


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