Electronics Forum: pass (Page 125 of 142)

Re: More informations on water clean for CSP/BGA package

Electronics Forum | Fri Oct 08 02:31:07 EDT 1999 | Brian

Hi, Help! Could anyone help to enlighten me on this? Question: If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowab

Re: MARKETING - HELP! E MADDY

Electronics Forum | Tue Sep 28 11:23:36 EDT 1999 | Scott Cook

GUYS THANKS FOR THE INFO YOU SENT ME . NOW FOR MY NEXT QUESTION. HOW DO I MARKET MY COMPANY? WHERE DO I BEGIN TO LOOK FOR NEW CUSTOMERS WILLING TO TAKE A CHANCE ON A NEW COMPANY WITH NO PROVEN TRACK RECORD? WHAT ARE SOME OF THE QUESTIONS I

Re: De-wetting

Electronics Forum | Thu Aug 19 19:04:55 EDT 1999 | Brian Wycoff

Can anyone help on the subject of de-wetting during the spray coating process. We use PC29M Parts A+B spray coating material, Humiseal tapes and masking dots, Marigold supertouch V70N gloves and Concoat CM533 liquid masking material. We also use

Re: BGAs and vapor phase

Electronics Forum | Mon Jul 19 12:37:15 EDT 1999 | Wolfgang Busko

Hi, SMTASSY that�s what we do, soldering our double-sided-finepitch-BGA-and all-the-other-stuff-boards in vapourphase because it�s the only thing we have. First, we do not do real series produktion, only prototyping up to som

little green men

Electronics Forum | Sat Jul 17 01:23:29 EDT 1999 | Scott McKee

I need a good chemical to remove the lacquer finish off of magnet wire. I know there are different kinds but I need one that really works. Any suggestions would be great. thanks in advance guys. What is it you're trying to do?

Re: bare board problem

Electronics Forum | Thu Jun 17 21:24:32 EDT 1999 | Dean

first of all what is the technical term for the small amount of solder on a plated pad. we are getting poor screen printing gasketing on a 20 mil qfp due to this solder not being even or too high in spots and not covering the length of the pads. an

Re: Criterion of PCBA bending degree

Electronics Forum | Fri Jun 11 04:38:05 EDT 1999 | Gyver

Hello all! Recently we got a problem about the Funtional test. Some boards passed tests by using the auto-fixture(vacuum), but failed by using manual test fixture(need to plug CPU, DIMM etc.). The error symptom is no picture. We d

Re: Criterion of PCBA bending degree

Electronics Forum | Mon Jun 14 09:16:58 EDT 1999 | Adam Pratt

Hello all! Recently we got a problem about the Funtional test. Some boards passed tests by using the auto-fixture(vacuum), but failed by using manual test fixture(need to plug CPU, DIMM etc.). The error symptom is no picture. We d

Re: Criterion of PCBA bending degree

Electronics Forum | Mon Jun 14 14:30:42 EDT 1999 | Deon Nungaray

Hello all! Recently we got a problem about the Funtional test. Some boards passed tests by using the auto-fixture(vacuum), but failed by using manual test fixture(need to plug CPU, DIMM etc.). The error symptom is no picture. We d

Re: Radial capacitors have water gain

Electronics Forum | Tue May 11 00:47:59 EDT 1999 | P.L. Sorenson - Technical Consultant

I left the company before this thing ever got resolved, so I don't know the answer, but here's what we did to get boards out the door. Baked them in a desicating oven. You know, the kind that pulls vacuum? It was a regular overnigh


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