Electronics Forum: pass (Page 128 of 150)

solder ball

Electronics Forum | Mon Dec 30 23:37:47 EST 2019 | agoesfirmanto

Hello All, I am a SMT Engineer from Indonesia, I am facing the problem of soldering balls in only one IC location, in other areas there are none. solder ball defect almost 30%. I have done several actions but failed to reduce the solder ball. 1.

Soldermask bubbles inmediately after screen printing

Electronics Forum | Sun Jul 26 07:52:35 EDT 2020 | sync40

Hello to everyone, Have you ever experienced soldermask bubbles inmediately after printed the soldermask itself? (for screen printing method of LPISM). I am not talking here about blistering or any outgassing defects after exposing to high temperatu

IPC pass/fail

Electronics Forum | Wed Dec 02 16:35:21 EST 2020 | kylehunter

> Hi Kyle, As per IPC 610, for class 3, this is > not acceptable, as your minimum fillet height has > to be either one of these two, whichever is > less: - solder thickness + 25% of the termination > height - solder thickness + 0.

Need help with my IoT Project ESP8266 NodeMcu to ESP12-E

Electronics Forum | Sat Mar 27 17:18:02 EDT 2021 | osfuco

Good evening, I am doing a project in which I want to measure air quality. I started the project with the ESP8266 NodeMcu board and three sensors, temperature (DHT22), VOC's (CCS811) and PM (PPD42). I have it all assembled with a breadboard and the

Implementing Standards and Requirements within a CM - When is too much?

Electronics Forum | Thu Jun 01 22:05:01 EDT 2023 | calebcsmt

For contract manufacturers, Unless expectations/requirements are particularly specified by customers OR there is a discussion and contract in place, what are the expectations when it comes to the assembly standards and practices? Is J-STD essenti

Lead Lift in QFP

Electronics Forum | Sat Jul 22 13:20:35 EDT 2023 | shrikant_borkar

Dear Abhishek, I too got the opportunity to investigate this defect Lift lead for SOT. Lead lift in IC, and SOT can occur due to various reasons. Here are some possible reasons for lead lift and ways to avoid them: During the assembly process, mecha

Re: Setting up solder material evaluation (suggestions?)

Electronics Forum | Tue May 04 14:42:58 EDT 1999 | Chrys Shea

| | I am about to embark on an effort to evaluate 3 different solder material suppliers and their recommended materials for our assembly process, in an effort to find the best supplier/material. We do mixed technology, with NOCLEAN chemistry so I wi

Re: Setting up solder material evaluation (suggestions?)

Electronics Forum | Mon May 10 07:53:48 EDT 1999 | Timothy O'Neill

| | | I am about to embark on an effort to evaluate 3 different solder material suppliers and their recommended materials for our assembly process, in an effort to find the best supplier/material. We do mixed technology, with NOCLEAN chemistry so I

Re: Setting up solder material evaluation (suggestions?)

Electronics Forum | Mon May 10 08:00:14 EDT 1999 | Timothy O'Neill

| | | | I am about to embark on an effort to evaluate 3 different solder material suppliers and their recommended materials for our assembly process, in an effort to find the best supplier/material. We do mixed technology, with NOCLEAN chemistry so

Re: Fond Farwell II (Why I hate aggresive sales and marketing)

Electronics Forum | Mon Apr 19 13:05:31 EDT 1999 | Bob

Steve, Like you, I am sick, sick, sick of marketing. I can't go on the Internet, to a ball game or my local 7-11 without being bombarded with marketing. 7-11? Would you belive I went there to buy a Sunday paper yesterday and now they have a 27" mo


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