Electronics Forum | Mon Oct 28 15:13:44 EDT 2013 | larrygroves
It will require an alignment. The tools are usually included in the toolbox, one L shaped magnetic tool, a small square glass plate and there is a tool in the nozzle changer. You can buy them seperately if you dont have them. There is a bigger qu
Electronics Forum | Fri Oct 25 14:45:59 EDT 2013 | rangarajd
Hi Guys, We are seeing signal integrity issues on PCBs due an improper pad size. We tried to trim down the pad size and it fixed the issue. Problem now is we have many assembled and blank PCBs. Is there a way we can have the pad size reduced on th
Electronics Forum | Fri Dec 20 15:38:53 EST 2013 | island2013
Aperature layout on your stencil could be a root cause as well. Home plate design aperatures have cleared this issue up for me in the past. If it's a clean product, running through the wash may get rid of quite a few of them. Also check your IPC s
Electronics Forum | Tue May 06 21:35:27 EDT 2014 | davef
Indium recommendations: 0201's: * Stencil Opening = 11mil x 16mil rectangle * Foot Print = 12mil x 15mil rectangle * Stencil Thickness = 5mils * Spacing = 9mils Note: The most common stencil being utilized, is the laser cut electropolished, and in so
Electronics Forum | Fri Jul 18 11:59:10 EDT 2014 | jagriffin
The good thing for me is I will not have these around for very long and they are prototypes.... We build fast and send them on to our EE's! What I have found to be my challenge is the wiping off of the miss prints on the first side... What I have rea
Electronics Forum | Mon Jul 21 03:48:06 EDT 2014 | edriansyah
Ensure you control the assembly completion. My previous experience, we control the assembly MUST be completed within 72 hrs, since you open the bare PCB seal, until you completed all the soldering process (Reflow & AWS). We manage to control the abo
Electronics Forum | Fri Oct 17 16:31:53 EDT 2014 | dyoungquist
Per IPC-A-610D: Target is 100% vertical fill but 75% vertical fill is acceptable for Class 1,2,3. Only needing 75% fill of the barrel when soldering plate through on an 0.093" thick board with our selective solder has been a life saver at times.
Electronics Forum | Thu Oct 30 21:55:13 EDT 2014 | davef
Why soldering issues? I'd guess the nickel is corroded. It is very difficult to solder to oxidized nickel. Your SAC305 would get kicked all the way down the conveyor by nickel oxide. A lack of Ni-Sn-IMC formation will confirm this dewetting . What's
Electronics Forum | Mon Jan 12 09:44:00 EST 2015 | rgduval
Oh yeah, I've seen this before! Generally, if the hole sizes are correct (including plating), and the PEMs are within spec, we've found that this is most commonly caused by insufficient support of the PCB during insertion. If you can eliminate supp
Electronics Forum | Fri Mar 06 10:11:02 EST 2015 | eezday
Hello Adriano, I see that you have ran several test with differnt valumes of solder paste which is a reasonable path. Have you run any solderability tests? Head in pillow is usually considered a solderability problem. Also, what type of plating a