Electronics Forum: $0.30 (Page 2 of 3)

FBGA Stencil Apertures

Electronics Forum | Wed Feb 07 09:46:20 EST 2001 | pjc

I need some guidance here. I've got a new board w/ a FBGA-48 package, Samsung CMOS SRAM. It's a full matrix BGA w/ 0.30mm-0.40mm ball diameter @ 0.75mm pitch. Balls are eutectic. PCB land diameter is 0.4mm. There are TSOP I 0.5mm lead pitch component

Solder past KOKI out of date. Can it be reviving

Electronics Forum | Mon Mar 24 20:30:01 EDT 2014 | davef

The "correct" answer is: Use the tests and methods that you used to qualify your solder paste in the first place. That sounds good but might not be all that practical for practicing assembly-types. Here's something that's not as good, but will give

LGA36 6.5 x 3.5 mm

Electronics Forum | Thu Apr 12 22:54:06 EDT 2007 | mika

conductor on the narrowest place ~0.07mm we suggest them to go for a PCB solder pad down to 0.30mm. The Conductor width is: 0.2mm The current problem they are having now is that there will be a problem with 14V to narrow the conductor to the narrowe

Component Package/Classification

Electronics Forum | Thu Apr 21 17:46:17 EDT 2005 | Frank

Russ, Your math is right, but you are converting the wrong direction. I belive: 0201s use millimeters for specification sizes, not inches. And 01005 use millimeters for specification sizes, not inches. And it may be like that for all passives, bu

Re: What is spec on stretch????

Electronics Forum | Mon Apr 19 10:14:12 EDT 1999 | Justin Medernach

| | | Hi, | | | I just cheesed my previous attempt at this. I looked through IPC 600 and couldn't find anything relating to dimensional stability of a board with regard to stretch. I found bow and twist but nothing on size. I have a PCB that is .0

Variable input/output relay ??? or alternative

Electronics Forum | Sun Oct 08 17:18:31 EDT 2000 | Scott

I have a problem, I have a radio control unit, which I need to power some low voltage lighting, the radio control unit is also used for two other items so I need to use it, the problem is that the current spike that is required when turning on the lo

Heat Sink for QFP

Electronics Forum | Tue Mar 28 08:29:04 EST 2006 | davef

Pad design - Standard IPC 20 pitch QFP Thermal pad design - Layout the thermal pad 0mm to 0.15mm larger per side (0mm to 0.30mm larger overall) than the exposed die pad on the package. �Larger than�, as opposed to the same size, is preferred. Obvio

0402 stencil design

Electronics Forum | Tue Feb 04 22:28:16 EST 2003 | davef

You could reduce the paste by about 70%. Solder balling and tombstoning will be the issues to fight. The drivers to these don't change with the component size. Use the fine SMTnet Archives for background. Aperture Size and Thickness of Solder Pas

Re: Need advise on regarding Vias

Electronics Forum | Tue Dec 14 22:17:33 EST 1999 | Dave F

Armin: How ya doin� bud? CK gives good advice, but I'd like to take a bit of a different angle. Q1. For 0.7 mm (0.027in) diameter hole for vias, what�s the minimum annular ring for this hole diameter? Depends on what you�re trying to do. For in

Re: Solder Paste volume w/reliability data.

Electronics Forum | Fri Jul 30 17:13:30 EDT 1999 | Dave F

| | | Looking for solder paste specification limits which have reliability data to support them. Currently, we are looking to define the min/max volume necessary to ensure a good joint on CBGA, PBGA, and Micro-BGA's. Any information will be greatly

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