Technical Library | 2003-05-05 07:36:58.0
The stencil selection process can be confusing, particularly when creating a stencil for a new application. This tutorial, which covers stencils for SMT and advanced IC packaging applications, offers guidelines to assist users in stencil selection and print optimization.
Technical Library | 2012-10-23 14:25:38.0
Tin-Silver-Copper alloys are the primary choice for lead-free SMT assembly. Although there are other options available such as alloys containing bismuth or indium and other elements, tin-silver-copper solders, also known as SAC alloys are by far the most popular. They are used by approximately 65% of users, as last surveyed by Soldertec in 2003.
Technical Library | 2020-02-05 18:20:06.0
Consortium Projects - Thermal Cycling Reliability Consortium projects allow for joint research to investigate the reliability of multiple solder alloys under a variety of environmental stress conditions. Project jointly sponsored by iNEMI and HDP User Group and including CALCE and Universal consortium currently assessing 15 third-generation solder alloys..
Technical Library | 2021-08-11 00:52:35.0
Formulators of multi-component adhesives, potting and encapsulation materials are careful not to supply products with entrapped air. They do this by manufacturing under vacuum or degassing them before supplying to the end user. Consequently, entrapped air in a mixed material is usually a processing issue.
Technical Library | 2021-12-27 13:28:49.0
Research Nester published a report titled "Oncology Information System Market: Global Demand Analysis & Opportunity Outlook 2030" which delivers a detailed overview of the global oncology information system market in terms of market segmentation by product, software, end-user, and by region.
Technical Library | 1999-05-07 08:57:51.0
As a first step towards a perceptual user interface, a computer vision color tracking algorithm is developed and applied towards tracking human faces. Computer vision algorithms that are intended to form part of a perceptual user interface must be fast and efficient. They must be able to track in real time yet not absorb a major share of computational resources: other tasks must be able to run while the visual interface is being used. The new algorithm developed here is based on a robust nonparametric technique for climbing density gradients to find the mode (peak) of probability distributions called the mean shift algorithm.
Technical Library | 2017-04-15 17:22:23.0
Few things are more exciting to manufacturers than new product ideas. New designs, engineering challenges and the ability to deliver a new user experience are all rewarding hallmarks of innovation. However, the road that separates conceptualization and commercialization is riddled with tight turns and obstacles. Fast, efficient prototyping is one of the best ways to prepare yourself for the journey.
Technical Library | 1999-05-06 12:00:47.0
The present problem with cooling microprocessors is a relatively new issue -- about 4 years old. It stems from the collision of two conflicting trends -- end-user desire for more powerful microprocessors to run the next generation software, and the equally strong demand for smaller, more mobile computer form factors. With each, the introduction of faster next-generation semiconductors aimed at improving computing power, heat concentration problems increase.
Technical Library | 2003-04-18 12:05:57.0
The popular tin (Sn) rich lead free solders are causing severe corrosion to many of the materials used in today's Wave Solder systems. Users are experiencing higher maintenance frequency and reduced life of wave solder machine components. This paper describes the effects of Sn rich solders in contact with various materials and discusses alternate methods to alleviate this problem.
Technical Library | 2006-12-18 14:55:35.0
Many solder users have preconceived notions and worries involving reflow profiling guidelines. Year after year of reading profiling recommendations in industry publications, from a litany of pundits, has made it clear that perfect profiles exist and should be sought after. They feel if the solder supplier gives them a tidy drawing on a piece of paper with times and temperatures that it will magically solve all their reflow problems. This is, unfortunately, an often incorrect assumption.
