Electronics Forum | Wed Sep 17 18:16:28 EDT 2008 | yam6rider
Adam, Most leadfree components can handle only 260C. When you doing the profile, you should put thermocouple on the of the BGA package and to ensure the temp is not go over 260C.
Electronics Forum | Thu Sep 18 14:32:36 EDT 2008 | jwentz
Ditto, we just went through this with a customer "fitting" our boards into a card cage. Mechanical stress/flexing.
Electronics Forum | Thu Sep 25 16:50:50 EDT 2008 | glennster
Ditto here, also. This is generally referred to as �cratering,� and is associated with stress on boards from operations such as ICT, installation of compliant pin connectors, and depanelization. It is more common on PCBs designed for Lead-free proc
Electronics Forum | Tue Feb 16 20:35:53 EST 2010 | davef
While you're waiting for others to reply, search the fine SMTnet Archives to find threads like: http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=29040
Electronics Forum | Thu Jun 18 14:25:21 EDT 2020 | sara_pcb
We have observed Plastic BGA crack in encapsulation to substrate interface. After reflow, the device was not functioning. The Crack is observed in the fresh lot during visual inspection. What is the attachment process of package to substrate? where c
Electronics Forum | Wed Feb 02 08:51:25 EST 2005 | Dougs
we have a capacitor cracking on one of our boards, there are four of the same cap on the board and only one cracks, we are seeing about 6% of the component cracking. it's not near the edges of the board and he board is 2.4mm thick so i dont think it
Electronics Forum | Tue Oct 25 13:55:26 EDT 2005 | Joe Wesley
Looking for idea''s on how to reduce cracking of components along viscore. We are placing within 0.020 and0.030 from edge in some cases but are seeing cracks on components placed all the way out at 0.150 off edge. Has anyone heard heating the boards
Electronics Forum | Thu Jul 22 05:43:56 EDT 2004 | jbtech
Can some one explain to me why the ceramic nozzles are cracking not on the tip but on the base??? also how long do the sleeves last, no informaton from siemens they just came in and changed from 'o'ring to bearing type?? Thanks Julie
Electronics Forum | Thu Feb 03 10:01:08 EST 2005 | Philj
Try heating a blank board on a hotplate to 183 deg C. with a board this thick, if the layer construction is poorly balanced, it may bend enough in the region of the ceramic capacitor for the soldered joints to crack it on cooling to ambient.
Electronics Forum | Tue Nov 08 17:12:10 EST 2005 | Erik
I haven't heard of heating boards pre-depanel either. We have done extensive studies on cracking of ceramic caps close to V-scored edges and have decided to have our board vendors pre-rout any areas with caps close (
