Electronics Forum | Mon Jan 06 11:23:30 EST 2003 | emeto
Hi all, Can anyone give me more info about Flip Chip assembly without underfill.Some technics,necessary equipment(optics,linear motors,accuracy and so on)or where i can read about it.
Electronics Forum | Wed Jan 08 03:27:18 EST 2003 | MA/NY DDave
Hi Another add, This depends on your application environment. If you have levels of shock and vibration or high thermals underfill is needed. YiE, MA/NY DDave
Electronics Forum | Mon Apr 01 20:33:30 EST 2002 | davef
Regarding your underfil ... * What material did you use as an underfil? * What machine and technique did you use to apply the underfil? * What type of component were you underfilling? * What was the end-use environment?
Electronics Forum | Mon Apr 01 13:00:27 EST 2002 | BTaylor
We had a problem with conformal coating getting under an IC and with Temp. and vibration would cause cracking of the solder bump, underfill solved the problem.
Electronics Forum | Wed Mar 27 18:23:01 EST 2002 | kmorris
Does anyone have experience doing conformal coating over Plastic BGA in High-Rel PCB assembly? Is underfill necessary to avoid problems with entrapped air, etc? Our application is a 17x17mm BGA, 256 I/O. We are assembling with a water soluable pas
Electronics Forum | Tue Apr 02 11:21:46 EST 2002 | BTaylor
davef I assume this question is for my reply and me. We used a dexter\hysol underfill and a Camalot 5700 to dispense.Single line technique next to a small IC with 14 bumps around the perimeter.The conformal coating was applied with a small brush aro
Electronics Forum | Tue Apr 02 22:52:38 EST 2002 | davef
Tks BT Can't be many places tougher than automotive, 'cept maybe oil field, down pipe. We use Dexter Hysol flow underfills for both 1 thou and 3 thou gaps, but they wouldn't come close to filling under a BGA. Most BGA are sitting about 16+ thou fr
Electronics Forum | Wed Apr 03 10:50:06 EST 2002 | BTaylor
Any time Dave I can tell from your responses you have been around this block as many times as I have.Your right automotive is tough nowadays not only from the quality standpoint, now they want everything for free.
Electronics Forum | Wed Mar 27 21:20:30 EST 2002 | davef
There is two major BGA coating camps. * Camp #1: "We require the coating to be under low stand-off devices but with no filleting. So we apply a thinned dip coat first, and then top-off with a proper spray coat" * Camp #2: "We want no coating under th
Electronics Forum | Thu Dec 01 00:34:15 EST 2005 | pyramus
Guy's another question, how about any recommendation what type of adhesive to use as underfill for BGA during lead free process? Currently, we are only using Loctite 3609 & 3515 as adhesive we use 3515 as BGA underfill during normal leaded process s
