Electronics Forum | Fri Jul 09 18:27:43 EDT 1999 | Scott Cook
Jim, GREAT to see you post and contribute. Nice to see the forum attracts experts in their field. 'Twas good seeing you at West again, bud. Scott Cook
Electronics Forum | Wed Aug 31 10:50:50 EDT 2005 | aj
Grant, We run the exact same process as you described. 5 thou stencil, 1:1 ratio aj
Electronics Forum | Thu Sep 01 14:30:06 EDT 2005 | lsmith
I have recently tried electroform (100% nickel) stencils. Expensive but awesome paste release. 5 mil foil 10 - 15% aperture reduction for gasketing
Electronics Forum | Fri Jul 09 17:50:20 EDT 1999 | Jim Blankenhorn
Hi Carol- What you are asking for can be done. Variables you must account for include the paste viscosity, dispensing head speed, dispenser height relative to board surface, and needle size. You can use most any semi-automated system such as Camalo
Electronics Forum | Wed Aug 31 11:02:28 EDT 2005 | Jason Fullerton
We are using one BGA that has 7 mil bumps on a 20 mil pitch. We use the manufacturer's recommended pad and aperature layout, which is an 11.8 mil square overprint on a 6 mil land. At 11.8 square, you need to use a 4 mil laser cut or a 5 mil e-form st
Electronics Forum | Fri Jul 09 19:35:05 EDT 1999 | Earl Moon
| Hi Carol- | What you are asking for can be done. Variables you must account for include the paste viscosity, dispensing head speed, dispenser height relative to board surface, and needle size. You can use most any semi-automated system such as Ca
Electronics Forum | Mon Aug 20 15:53:52 EDT 2007 | erhard
Manufacturing already tried to get a design change but no chance. I guess because the designer is afraid the components could get bent too much if they are mounted with a stand off. Of course everyone who has to manufacture this fist sais: why don't
Electronics Forum | Sun Jun 16 08:00:51 EDT 2013 | zaldytorres
Does anyone have suggestion how to modify radial insertion machine to 3.5mm pitch? I have to insert 3.5mm pitch Ecap but the industry standard radial machine could mount only 2.5 or 5 mm pitch. changing PCB or parts is not an option as it is not appr
Electronics Forum | Mon Aug 20 05:53:26 EDT 2007 | erhard
Hello all, we are about to modify a Universal Radial 5 so the machine will be able to insert radial components with lead pitch 3.5mm and 5mm. The 3.5mm components are ELCOs which are getting inserted all the way to the component body so they sit fi
Electronics Forum | Tue Oct 04 20:18:17 EDT 2011 | denmark
Sir *We are using "HOT BAR SOLDERING" we are bonding "FFC" and "PCB" at 0.5mm pitch. Machine settings: Heating Temp. 310º, Colling Temp. 190º Delay Time 1sec We also using "BECKLITE" as Soldering Jig that can resist up to 400º. We are using 1 is to
