Electronics Forum | Wed Aug 25 15:54:46 EDT 2010 | blnorman
I previously did a search on "peel back force" > and there were a few results, and there were a > few hits that say EIA-481 is the standard, but > nothing on what the standard force range is. A > search on "cover tape" yeilds many hits about >
Electronics Forum | Fri Mar 22 21:31:25 EST 2002 | ianchan
Hi Guys, Anyone have "comments/testimony" on having possible quality level achievements, for AQL=0.1, C=0 ??? Is this a realistic "1st Pass Yield" expectation? how about for OQC submission Lots from production? especially in a high-mix, low-volu
Electronics Forum | Tue Aug 23 09:02:12 EDT 2005 | Bob R.
There are several methods in IPC-TM-650 depending on whether you're testing for the effect of flux residues or board cleanliness. They're available for free download here: http://www.ipc.org/contentpage.asp?PageID=4.1.0.1.1.6
Electronics Forum | Tue May 05 09:58:51 EDT 2015 | anirudh_thabjul
hi everyone, I have done with my PCB Prototyping. I need to Prepare a Bill of Materials(BOM) for my PCB Assembly. I have one doubt regarding selection of SMD Capacitor. -My Question is For Example, I have to use 0.1uF capacitor on my PCB board.In
Electronics Forum | Tue Apr 10 14:35:52 EDT 2007 | UT
We are in middle to prototyping a lead free assembly for one of our customers. We are using lead free bare PCBs, consumables and components, except for two ICs which are leaded per the customer BOM. Will the overall assembly be defined as lead free p
Electronics Forum | Sat Sep 13 08:35:14 EDT 2008 | davef
2.0V at 0.1mA for InGaN product and >1.4V at 0.1mA for AlInGaP product." It's common for ESD protection programs to conform to ANSI/ESD S20.20 - Protection of Electrical and Electronic Parts, Assemblies and Equipment (Excluding Electrically Initiate
Electronics Forum | Fri Apr 17 07:45:43 EDT 1998 | Robert Meston
We have to mount our SMD devices 0.1 to 0.4 mm off the pcb PCb substrate to compensate for thermal stressing in a Space enviroment. Has any one any ideas or contacts for dissolvable pads. this only applies to leadless components
Electronics Forum | Tue Aug 20 21:39:29 EDT 2019 | sssamw
6 mil (0.15mm) for the 1.13mm pitch BGA, and 4 mil (0.1mm) for the smal QFN with 0.4mm pitch.
Electronics Forum | Fri Jun 15 05:28:55 EDT 2012 | eniac
DeanM, if I understood correct, you use fiducial with dimension 0.1 mm and increased it to 0.15 mm. Why use use small fiducials? You don't have free space on your PCBs?
Electronics Forum | Sat Oct 21 23:49:22 EDT 2000 | Garth Fitzner
I have been wave soldering LCD's for about five years now and have done many thousands. As someone else mentioned they go dark when heated but then clear as the temp comes back down. The amount of failures attributable to the wave process has been l
