Electronics Forum | Wed Sep 22 17:21:45 EDT 1999 | Hugh Martin
| | | | | | I like to see if anyone has any info or experinces with metal inspection templates in a post oven process. | | | | | | My problem issue is the ESD, since they are metal(12 mil stencil material). I welcome any comment. | | | | | | | | | |
Electronics Forum | Mon Dec 30 23:37:47 EST 2019 | agoesfirmanto
Hello All, I am a SMT Engineer from Indonesia, I am facing the problem of soldering balls in only one IC location, in other areas there are none. solder ball defect almost 30%. I have done several actions but failed to reduce the solder ball. 1.
Electronics Forum | Wed Oct 06 04:23:09 EDT 1999 | Brian
| | I am a new employee at a company that has had a large turnover of employees over the past year. I am working on a board (components on one side only), the engineer (he is also new ) wants to use an .035 pad with a .021 dia. hole, there are no via
Electronics Forum | Sat Aug 10 10:57:23 EDT 2002 | finepitch
> A/cph, then you need a second chip shooter. Then each chip shooter will place B/2 parts and possibly catch up with the pick&place machine. If the line has 2 chipshooters and a pick&place, it will be pretty hard to use the one unused chipshooter fo
