Electronics Forum | Wed Jun 20 12:07:13 EDT 2001 | Steve
I would suggest getting a copy of IPC-SM-782A, Surface Mount Design and Land Pattern Standard, and IPC-7525 Stencil Design Guidelines. My experience is that reflow does not cause tombstoning very often. Pad and land design, paste volume, and placemen
Electronics Forum | Sun Jun 10 11:31:27 EDT 2001 | nifhail
Everybody aware of the tomb-stone problem on 0402 package. I've done everything I could i.e. Profile, placement, 10 Deg placement, stencil design, but still this culprit exist. One things for sure is taht I have a very bad pad size for 0402 ( 25 mil
Electronics Forum | Thu Oct 14 11:28:38 EDT 1999 | Bryan
We recently started designing boards using 0402's. The geometry was built using IPC specs but our contract manufacturer is having a yield problem. Approx. 20% of the 0402's are tombstoning. He claims the pads should be closer together; .4 mm between
Electronics Forum | Thu Oct 20 10:31:27 EDT 2011 | ck_the_flip
What is the industry standard pad geometry (dimensions and spacings) for 0402 components?
Electronics Forum | Wed Jun 12 10:42:06 EDT 2002 | stepheno
Check your land patterns. I believe someone once made a typo on specs for land pattern spacing and the specs are still being used by some people. I worked for a CM that had a customer that spaced the pads for 0402's too far apart. It was the only
Electronics Forum | Thu Nov 02 17:15:34 EST 2000 | Erdem Bilaloglu
We are using semi-circular land pattern and 0.004" smaller appertures on screen. With stable rising slope (max:2.6degC/sec)we have not experienced any tombstonning so far.
Electronics Forum | Mon Nov 01 10:16:42 EST 1999 | Mark Anderson
I am interested in getting some feedback on what different companies are doing to eliminate the solder beading issues on 0603, 0402 chip components using a no-clean process. We are currently incorporating a solder mask removal between the solder lan
Electronics Forum | Wed Nov 07 21:16:44 EST 2001 | davef
Consider using the following hierarchy of rules for pad design: 1. If you have a land pattern in a manufacturer�s data sheet, use it. 2. If the data sheet doesn't have a land pattern, but does have an RLP (registered land pattern) number or JEDEC n
Electronics Forum | Fri Aug 03 05:13:01 EDT 2001 | mugen
Well none of us, really know whether, this 0805 CAP is really an unsolder/tombstone defect, coz none of us verfied this with, our own eyes *duh* Funny, this only happened for us, on 0402 ~ 0201 SMD.... Check your land-pad design specifications, if
Electronics Forum | Wed Jun 24 18:44:14 EDT 2009 | mark_h
Hi Everyone My company has done loads of 0402 placements but are now required to start looking at 0201 and micro BGA placements. I’ve done loads of research and I’m happy with stencil design, area ratio, oven profile, machine requirements and paste r
