Electronics Forum | Thu Jul 05 20:30:00 EDT 2001 | dlkearns1
I've never seen this and was wondering how bad is this? We've tried to re-create this defect, but could not. Comments????????
Electronics Forum | Sun Nov 28 20:30:51 EST 1999 | Greg H
What are the possible consequences when there's a flux entrapment (location: vias under components)under components during wave soldering? thanks
Electronics Forum | Mon Jun 15 20:30:39 EDT 1998 | Nancy J Dawdy
Would anybody like to share experiences with adding and using the SECS/GEM interface on a multi-vendor line(DEK,FUJI,PANASONIC, UNIVERSAL,BTU)???
Electronics Forum | Tue Jan 22 20:30:44 EST 2002 | davef
Start with the following: * Aegis ISC (Circuit CAM) * Mitron (GenRad) (CIMBridge) * CAE Technologies (C-Link)
Electronics Forum | Wed May 22 20:30:52 EDT 2002 | ianchan
xzinxzin, de Process Engineer, Ah....HAH! bingo! go search the fine SMTnet archives. cuppa of threads posted within specific to this nature of inquiry of yours.
Electronics Forum | Wed Jul 24 22:20:30 EDT 2002 | mantis
we have 3 Rad 8's and never use the verifer cause its too bloody slow.Why bother u cant verify parts being placed on a chip shooter so if your operator takes the same care when loading a reel there should be no need to verify.
Electronics Forum | Wed Oct 30 15:20:30 EST 2002 | Dan
I am wondering what the general concensus is for handling PCB's. Do bare hands pose a problem for PCB assy's? Should operators who handle boards wear gloves? Thanks for your input.
Electronics Forum | Sat Feb 14 20:30:55 EST 2004 | Dean
What are your preheat rates? Try a slower ramp. A typical insurance policy is to kapton tape the gold card edge. If your problem persists, try baking the boards to drive the moisture out.
Electronics Forum | Thu Jul 01 09:53:12 EDT 2004 | randygray
This depends on the options that the machine is equiped w/ Green camera, Vacuum under stencil wipe, etc.. Price range for 1998 20-30K US Regards, rgray
Electronics Forum | Wed Oct 20 13:53:22 EDT 2004 | Greg D
Hi, What's the maximum and minimum solder void that can be accepted during X-ray? What about the percentage of Ball Roundness..20%? 30%? thanks and regards,
