Electronics Forum | Thu Nov 21 01:40:11 EST 2002 | ruimsig
The cause of grainy joints is either too high reflow max 225�C, 90 seconds or the reflow temp was tp low
Electronics Forum | Fri Feb 27 16:02:20 EST 2004 | Zaxx
Hi Paul, One way but it slows down the process, is to get fixturing pallets made. You can usually get a universal fixture made for anywhere from $185-225USD. Hopefully this can help. Sincerely, Zack Schmad
Electronics Forum | Mon Jun 14 17:21:31 EDT 2004 | russ
How old are these parts? Sn/Ni plating is very succeptable to age and everything else. They are possibly tarnished. Also, what is your peak temp in reflow? It takes about 225 230 C to get good wetting to the underlying nickel. Russ
Electronics Forum | Tue Jun 15 08:22:39 EDT 2004 | jsmith01
The parts are dated Mar 20 2004. My profile hits a peek of around 232-240c and is above 225 for around 30 seconds.
Electronics Forum | Mon Aug 23 12:13:57 EDT 2004 | ozzy
I have problem finding the values of two caps that are surface mount. There ID's are: One cap has a code of 1A5 the other cap has 225 16g 408 (yellow with a stripe) Thanks
Electronics Forum | Wed Dec 15 08:44:50 EST 2004 | cardinal
Hi Patrick, For UP 78 the best profile is also the easiest. Straight ramp to 220-225 1-2 degrees C per second TAL 45-60 seconds drop it staight off The Tech bulletin says the exact same thing. Former Alpha Guy here
Electronics Forum | Sat Jan 15 23:58:24 EST 2005 | Chua
Could you advise what is the min and max peak temperature for this process. Presently, my leaded peak temperature at the range of 215 - 225 deg.C And how do I know that the solderability is at optimal. Appreciate your help......
Electronics Forum | Wed Nov 09 10:02:42 EST 2005 | Tim
You should be baking above 100C/212F to ensure that you're driving moisture out of the board. Four hours at 225F is usually enough to dry out most multilayer PWBs.
Electronics Forum | Fri Sep 15 05:37:49 EDT 2006 | Rob
Are you talking 0.02" (1.225mm) if so then no it's not a great idea. if you must wave it can you go to a PLCC and through hole socket it on the other side of the board?
Electronics Forum | Wed Oct 04 16:30:12 EDT 2006 | russ
I hope you are not trying to melt the Ceramic BGA columns. these are not meant to melt. I would run a lead process at peak temp of 225 -230C with lead paste. The board warpage may be of design issue or Manufacture issue. Russ
